- Demand for xEV Batteries to Grow 17% in 2017 on Back of Recovery of China’s xEV Market
2016.12.09 10:31:39 /
- RDA's 4G RF Power Amplifier Module RPM6741-21 Receives Certification from Qualcomm
2016.12.09 09:59:09 /
- Bluetooth SIG Officially Launches Bluetooth 5 Specification
2016.12.08 10:55:09 /
- Keysight to Demonstrate Latest 5G, 802.11ad Design and Test Solutions at IEEE Globecom 2016
2016.12.08 10:40:10 /
Toradex announced the support of Windows Embedded Compact 2013 (WEC2013) and Windows Embedded Compact 7 (WEC7), on its new Colibri iMX7 - a NXP i.MX 7 processor-based System on Module (SoM). A preview WinCE OS image is available for down...
congatec has released the conga-MA5, the next generation of low-power modules for the industrial and extended temperature range in the credit card sized COM Express Mini form factor. The new COM Express Type 10 Computer-on-Modules are equip...
Texas Instruments (TI) introduced the industry's highest-density, 18-V input, 35-A synchronous DC/DC buck converter, which offers full differential remote-voltage sensing and PMBus to support telemetry. TI's TPS546C23 power converter inte...
Nordic Semiconductor today announces the launch of its Bluetooth 5 ready nRF52840 SoC with features and capabilities that redefine the performance envelope of single-chip Bluetooth® low energy applications: especially in smart home and adv...
Toshiba Corporation’s Storage & Electronic Devices Solutions Company today announced the launch of a 1.3A output current CMOS LDO regulator, TCR13AGADJ, for use in the power supplies of mobile devices, housed in the industry’s leading-c...
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