Taipei, Monday, Feb 27, 2017, 19:20

More IoTs Solutions

NEC and Japanese cooperation in the use of AI and IoT to enhance the plant operating efficiency (2017.02.17)

Nippon Electric Co., Ltd. and Nippon Electric Co., Ltd. (NEC) announced that the two sides began to cooperate with AI (Artificial Intelligence) and IoT (Internet of Things), to provide factory operation data analysis of related services...

ASIX adds BLE Module and BLE to Wi-Fi Gateway Solution to Its IoT Portfolio (2017.02.13)

ASIX Electronics announced the addition of the AXB021 Bluetooth Low Energy (BLE) module to the embedded wireless modules product line and the support of the BLE to Wi-Fi gateway solution. With ASIX IoT solution, customers can rapidly develop wireless IoT, home healthcare, and industrial applications by making it easier to decrease costs, development time and footprint...

AOPEN Partners With Intel To Unveil Visual Data Reference Design Device (2017.02.09)

AOPEN announced its Intel Xeon processor-based DE7400XE Visual Data Reference digital engine. This collaboration and partnership with Intel defines standard ways of consolidating workload of IoT applications and brings greater capabilities to the edge between cloud and client architecture...

NEC and DENSO cooperate with AI, IoT in high-level driving assistance and automatic driving (2017.02.09)

DENSO and NEC are cooperating in the field of high-end driving assistance, automatic driving and related manufacturing to maintain the global environment and achieve a safe and secure vehicle society. DENSO's "High Technology and Manufacturing Capabilities" developed in the automotive market...

8.4 Billion Connected "Things" Will Be in Use in 2017 (2017.02.07)

Gartner, Inc. forecasts that 8.4 billion connected things will be in use worldwide in 2017, up 31 percent from 2016, and will reach 20.4 billion by 2020. Total spending on endpoints and services will reach almost $2 trillion in 2017...

COMPUTEX's InnoVEX 2017 to Focus on AI and IoT (2017.02.06)

TAIPEI, Taiwan- Taipei Computer Association (TCA), one of organizers of COMPUTEX, said that the InnoVEX 2017 startup exhibition will start from May 30 to June 1 at COMPUTEX at the Taipei World Trade Center (TWTC) for a period of three days...

Qualcomm and TDK Announce Launch of Joint Venture (2017.02.06)

Qualcomm Incorporated and TDK Corporation announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments...

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