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New Ultra-Low Power Flash Memory From Macronix Targets Wearable Devices

瀏覽次數:2591

HSIHCHU, Taiwan – Macronix has launched a new family of wide-voltage, ultra-low-power NOR Flash memory products designed for next-generation wearable devices. The MX25R family features power consumption that is 60% lower than that of traditional devices and a Vcc wide-voltage span of 1.7V–3.6V to support diverse requirements of wearable devices.

The MX25R family supports the standard Serial NOR Flash memory interface with ultra-small product packages such as USON and WLCSP, and KGD (known good die) products for SIP (system-in-package) solutions.

“Low power consumption and small form-factor designs will be key factors in consumer acceptance of wearable devices,” stated Mr. Min-Cheng Lin, Macronix segment marketing department deputy director.

“We see next-generation memory advancing in three ways: 1. Standardized interfaces that will ease the process of importing data; 2. Smaller, lighter and slimmer form factors; 3. Power supply design focused on ultra-low voltage and energy consumption.”

Besides its wide-voltage/ultra-low power MX25R family, Macronix solutions popular in wearable products consist of 1.8V 512Kb–512Mb Serial NOR devices. These are offered in small footprints such as KGD (known good die) and WLCSP (wafer-level chip-scale packages).

Macronix MCP (multi-chip package) memory has also been utilized in many smart wearable products. The Company’s intensive research and development of innovative memory technologies has delivered VG (vertical gate) 3D NAND, using its own patented BE-SONOS technology to break through manufacturing process restrictions; and ReRAM (resistive random-access memory) technology utilizing a simple storage unit structure that features high speed and low power consumption for future wearable applications.

Features:

- 1.7V ~ 3.6V Serial NOR (MX25R): 512Kb ~ 64Mb

- Packages: 8-SOP、8-WSON、8-USON、WLCSP、KGD

- 64Mb (sampling now)

- 1.8V Serial NOR (MX25/66U): 512Kb ~ 512Mb

- Packages: 2*3/ 4*3/ 4*4 USON、6*5/ 6*8 WSON、WLCSP、KGD

- MX65U ( SPI-NOR + pSRAM) : 64Mb+32Mb, 128Mb +64Mb

- MX69N ( AD-Mux PNOR + pSRAM): 64Mb +32Mb

- MX69V ( AD-MUX PNOR + pSRAM): 128Mb +64Mb

- Packages: 6.2*7.7 , 6*6 TFBGA

- MX63U (SLC NAND + LPDDR2): 4Gb+2Gb, 2Gb+1Gb, 1Gb+1Gb

- Packages: 8*10.5 VFBGA, 8*9 VFBGA

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機
特別企劃半導體

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

關鍵字:wearable deviceIoT