達發科技專注四大關鍵技術 鎖定寬頻、車用、低軌衛星 (2023.07.31)
達發科技過去20年，全程參與從 xDSL 銅線至 GPON、xG-PON 光纖迭代網通核心晶片技術。各世代固網規格發佈底定後，發展至市場普及約十年，迭代過程持續累積高門檻技術能力，市場極具長尾價值，將是達發未來成長主力技術之一。 達發科技隨…
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Microchip推出SAM9X60D1G-SOM 大幅降低設計複雜性 (2022.08.05)
隨著嵌入式市場快速發展，開發人員無不致力於優化產品開發過程，其中即可能包括從微控制器（MCU）到微處理器（MPU）的轉型以因應更高的處理需求。 為了協助開發人員順利進行轉型並降低設計複雜性，Microchip Technology Inc.…
萊迪思推MachXO5-NX系列 擴大FPGA安全控制能力 (2022.06.01)
萊迪思半導體推出萊迪思MachXO5-NX系列，以萊迪思Nexus平台打造的第五款FPGA元件，進一步鞏固萊迪思在安全控制FPGA領域長期的領導地位。MachXO5-NX FPGA透過增加的邏輯和記憶體資源、強大的3.3 V I/O支援，以…
萊迪思推出專為汽車應用優化的Certus-NX FPGA (2021.08.26)
萊迪思半導體公司今日宣佈推出專為資訊娛樂系統、先進駕駛輔助系統（ADAS）以及安全應用優化的全新Certus-NX FPGA系列的汽車級產品，繼續拓展其不斷完善的汽車產品系列。這些基於萊迪思Nexus平台的全新Certus-NX元件不僅擁有…
艾訊與flexiWAN合作 通過認證部署白盒硬體uCPE設備 (2021.08.19)
為了協助服務供應商、系統整合商與企業利用更廣泛的網路設備，艾訊公司（Axiomtek）宣布與全球SD-WAN & SASE開源軟體技術先驅flexiWAN建立合作夥伴關係，選擇實現第三方虛擬化網路功能（Virtualized Network…
TAIPEI, Taiwan - Acer unveiled its first Chromebook with new AMD Ryzen 3000 C-Series Mobile Processors and AMD Radeon gr…
COM-HPC整合設計重要里程碑 康佳特推出新生態系統 (2020.11.24)
德國康佳特宣布推出首批COM-HPC載板和散熱解決方案，為全新PICMG COM-HPC標準奠定了新的生態系統基礎。這是COM-HPC整合\的一個重大里程碑，加速搭載第11代Intel Core處理器（代號Tiger Lake）的康佳特CO…
Advantech today announced its new FWA-1112VC network appliance, which introduces a series of innovative features to its …
Fujitsu announced the launch of six models of Notebook LIFEBOOK with Windows 10 and the latest 10th generation Intel Cor…
Fujitsu announced the launch of seven models of Notebook LIFEBOOK with Windows 10 and the latest 10th generation Intel C…
Samsung Electronics Introduces New 3D Memory With Sixth-gen V-NAND SSDs for Client Computing (2019.08.06)
Samsung Electronics announced that it has begun mass producing 250-gigabyte (GB) SATA solid state drive (SSD) that integ…
Samsung Electronics announced that it has begun mass producing the industry’s first 12-gigabit (Gb) LPDDR5 mobile DRAM, …
芯科Si539x新型元件 簡化高速網路時脈設計 (2019.06.20)
Silicon Labs(亦名「芯科科技」)宣布擴展Si539x抖動衰減器系列產品，新型元件具備完全整合的參考時脈、強化的系統可靠性和效能，同時簡化高速網路設計中的PCB佈局。新型Si539x抖動衰減器設計旨在滿足100/200/400/6…
Portwell announces the release of the RICH-61D0, a fanless embedded system featuring Intel Atom processor N series (form…
TAIPEI, Taiwan — AppNeta and AAEON announced that the two companies have partnered to offer new product enhancements to …
AppNeta and AAEON today announced that the two companies have partnered to offer new product enhancements to AppNeta’s p…
DRAMeXchange, a division of TrendForce, reports that the global NAND Flash market has stayed in oversupply since the tra…
3Q18 Contract Price Hike for Server DRAM Limited Due to Improved Supply, Says TrendForce (2018.06.25)
The shortfall in the supply of server DRAM may ease in the second half, as evidenced by the increasing average shipment …
Samsung Electronics today announced that it has launched an 800-gigabyte (GB) solid state storage drive—the SZ985 Z-SSD,…
TE Connectivity 推出SFP28和QSFP28電纜組件 (2018.01.24)
TE Connectivity（TE）憑藉著信號完整性專業知識，可以提供市面上性能最高的25 Gbps SFP28和QSFP28電纜組件產品組合。 TE的電纜組件支持的聚合數據傳輸率為100 Gbps和200 Gbps，TE不僅提供這些25…