Microchip 擴展 maXTouch M1 觸控螢幕控制器系列，涵蓋更大顯示尺寸範圍 (2026.02.04)

Microchip Technology宣布擴展其 maXTouchR M1 觸控螢幕控制器系列，進一步強化車用顯示應用中的可靠與安全觸控偵測能力。此次產品線擴充擴大了顯示尺寸支援範圍，可對應 最大 42 吋的自由曲面寬螢幕顯示器，同時也涵…

電化學遷移ECM現象如何預防? (2022.08.15)

晶片應用日益複雜，精密度不斷提升，在執行高加速應力試驗時，容易產生「電化學遷移」（ECM）現象，本文將從外至內深入探討此問題，並分享如何預防ECM現象發生。…

宜特引進真空壓力烤箱 助消除underfill周圍氣泡 (2021.01.22)

宜特宣布，近日引進真空壓力烤箱，可依據不同膠材黏度調整真空及壓力參數，做到0 % Void，徹底將Underfill製程品質做到最好，避免因Void原因，影響可靠度測試結果。 宜特指出，現階段，晶片採取細小間距的球閘陣列封裝(Ball gr…

TI推出最小的36V、4-A 電源模組 有助縮減解決方案尺寸達30% (2020.02.20)

德州儀器（TI）近日推出了最小的36V、4-A電源模組，其採用四方扁平無引線（QFN）封裝。TPSM53604 DC/DC降壓模組的5mm x 5.5mm面積使工程師能將電源尺寸縮小30%，且與同類競爭模組相比，功耗更降低50%。新的電源模…

ITRI Takes Home Two 2019 R&D 100 Awards (2019.12.10)

TAIPEI, Taiwan - The 2019 R&D 100 Awards held its award gala in San Mateo, CA on December 5th to recognize the top 100 i…

Winbond Releases 2Gb NAND+2Gb LPDDR4x Multi-Chip Package for 5G CPE Modems (2019.07.03)

TAICHUNG CITY, Taiwan-- Winbond Electronics today announced the launch of a new 1.8V 2Gb+2Gb NAND Flash and LPDDR4x memo…

New Alliance Memory High-Speed CMOS PSRAMs Offer 8Mb to 128Mb in 48/49-Ball FPBGA Packages (2018.10.25)

Alliance Memory introduced a new family of high-speed CMOS pseudo SRAMs (PSRAMs) with densities from 8Mb to 128Mb in 6.0…

Alliance Memory Expands Low-Power SDRAM Portfolio (2018.05.09)

Alliance Memory announced that its SDRAM portfolio now features a wide variety of components that combine low power cons…

美光旗下Crucial推出64層3D SSD與Ballistix可調光電競DDR4記憶體 (2018.01.25)

美光旗下通路品牌Crucial與Ballistix推出新一代MX500固態硬碟與Tactical Tracer RGB記憶體。MX500 使用第二代Micron 3D NAND技術，並採用64層堆疊以及浮匣技術，使用「CMOS Under …

u-blox Enables the World’s First Narrowband IoT Based Smart Street Lighting System (2017.08.31)

u blox announced that its SARA-N2 series of NB IoT (LTE Cat NB1) modules is enabling the world’s first Narrowband IoT (N…

Toshiba Memory Unveils 64-Layer, 3D Flash Memory, Single Package NVMe Client SSD (2017.08.03)

Toshiba Memory Corporation today announced the launch of the BG3 series, a new line-up of single package NVM Express (NV…

New 1Gb, 2Gb, and 4Gb Mobile LPDDR2 SDRAMs From Alliance Memory (2017.04.13)

Alliance Memory introduced a new line of high-speed CMOS mobile low-power DDR2 (LPDDR2) SDRAMs with densities of 1Gb, 2G…

Alliance Memory New High-speed CMOS 16Gb Mobile LPDDR3 SDRAM (2017.03.01)

Alliance Memory introduced a new high-speed CMOS mobile low-power DDR3 (LPDDR3) SDRAM designed to extend battery life in…

Intel Announces the Atom E3900 Series for IoT Applications (2016.10.26)

Intel announced the Intel Atom processor E3900 series (Apollo Lake). Jonathan Ballon introduced the new processor as par…

Alliance Memory's New 512-Mb High-Speed Mobile SDR SDRAM (2016.10.06)

Alliance Memory introduced two new high-speed CMOS mobile synchronous DRAMs (MSDR) designed to extend battery life in mo…

Industry’s First 512-Gigabyte NVMe SSD in a Single BGA Package (2016.05.31)

Samsung Electronics announced today that it has begun mass producing the industry’s first NVMe PCIe solid state drive (S…

Advanced Semiconductor Packaging Drives Materials Consumption through 2019, SEMI Says (2015.12.15)

According to SEMI, the $18 billion semiconductor packaging materials will undergo steady single-digit unit volume growth…

是德科技推出小型BGA內插式探棒解決方案 (2015.09.01)

是德科技（Keysight）日前推出BGA（球柵陣列）內插式探棒解決方案，讓工程師能夠使用邏輯分析儀測試DDR4 x16 DRAM（動態隨機存取記憶體）設計。藉由使用Keysight W4636A DDR4 x16 BGA內插式探棒解決方案…

World's Smallest BGA Interposer Solution for Probing DDR4 x16 Designs (2015.07.09)

Keysight Technologies introduced a BGA (ball grid array) interposer solution for testing DDR4 x16 DRAM (dynamic random a…

Microsemi Introduces Second Generation Highly Secure 64GB SSD (2015.03.17)

Microsemi Corporation introduced its second generation highly secure 64 gigabyte (GB) solid state drive (SSD). With data…