ROHM開發出支援GaN高頻開關的TP-PFC控制器IC (2026.10.30)
半導體製造商ROHM（總公司：日本京都市）開發出有助實現小型高效率AC-DC電源的Totem Pole PFC*1（圖騰柱PFC，以下簡稱TP-PFC）控制器IC「BM85060FV」，特點是可在支援GaN HEMT*2高頻開關的MHz頻段…
搜尋「E-Mobility」，共 78 筆
Accuron Technologies (Accuron), in partnership with Hyundai CRADLE—Hyundai Motor’s corporate venturing and open innovati…
Ceva蜂巢式物聯網平台整合至意法半導體NB-IoT工業模組 (2024.07.19)
《愛立信行動市場報告》(Ericsson Mobility Report)預測，蜂巢式物聯網連接數量將從2023年的30億增長到2029年的61億，複合年增長率達到12%。Ceva公司致力於使智慧邊緣（Smart Edge）設備能夠更可靠且…
u-blox and ORBCOMM have announced today their partnership to start developing solutions for the convergence of terrestri…
TAIPEI, Taiwan – STMicroelectronics (STM) and Soitec (Euronext Paris) announce the next stage of their cooperation on Si…
CEVA支援推動之蜂巢式物聯網晶片 滿足大規模物聯網應用 (2022.03.08)
CEVA宣佈自2020年初以來，CEVA的授權許可廠商已出貨超過1億顆，由CEVA支援推動的蜂巢式物聯網晶片產品。 此一重要里程碑的實現，是來自於穿戴式裝置、智慧電表、資產追蹤和工業設備等，迅速採用蜂巢式連接技術，並且這些裝置都採納LTE …
意法半導體收購Norstel AB 強化碳化矽產業供應鏈 (2021.09.03)
碳化矽（SiC）功率半導體市場需求激增，吸引產業鏈相關企業的關注，國際間碳化矽晶圓的開發，驅使SiC爭奪戰正一觸即發。…
Renesas Electronics announced its collaboration with Microsoft to accelerate the development of connected vehicles. Rene…
愛立信：5G全球用戶上修2.2億 東北亞佔80% (2020.12.07)
回顧2020年全球5G發展，可謂可圈可點，儘管疫情與國際政治情勢跌宕多變，5G部署速度卻不斷在加速。愛立信最近更新之2020年《愛立信行動趨勢報告》（Ericsson Mobility Report）預測至2020年底，5G覆蓋區域人口將破…
unitech Electronics today revealed the EA630 Rugged Smartphone , offering 80% screen to body ratio, featuring versatile …
用於射頻前端模組的異質三五族CMOS技術 (2020.02.10)
隨著首批商用5G無線網路陸續啟用，愛美科為5G及未來世代通訊應用準備了下世代的行動手持裝置。…
Infineon and Synopsys Collaborate to Accelerate Artificial Intelligence in Automotive Applications (2019.09.17)
Infineon Technologies has started a collaboration with. Next-generation AURIX microcontrollers from Infineon will integr…
Mitsubishi Electric Develops World's First Multi-Cell GaN-HEMT Bonded Directly to Diamond Substrate (2019.09.02)
Mitsubishi Electric announced today that in collaboration with the Research Center for Ubiquitous MEMS and Micro Enginee…
Audi 扶植台灣優秀新創 發掘智慧移動的創意解方 (2018.11.16)
‧ Audi舉辦Audi Innovation Award，幫助在地新創與世界接軌 ‧ Audi首次參加Meet Taipei 創新創業嘉年華，邀請Audi Innovation Award優選台灣新創團隊，模擬2025年的智慧移動生活 A…
TIntepro Systems announces its advanced benchtop/rack mount Procyon Battery Test System for engineering design and produ…
CEVA推出eNB-IoT 版本14解決方案 擴大在NB-IoT IP的布局 (2018.07.02)
CEVA以快速發展的NB-IoT市場為目標，發佈了其廣受歡迎的CEVA-Dragonfly NB1解決方案的後續產品，高整合度的CEVA-Dragonfly NB2是針對Cat-NB2 (3GPP版本14 eNB-IoT)最佳化的模組化解決…
According to a custom study on the Personal Computing Device market by verticals, 2017Q4, the Asia Pacific (excluding Ja…
拉丁美洲邁入工業4.0 2018漢諾威展主打連網與協作 (2018.04.03)
今年展覽以「工業整合-連網與協作」（Integrated Industry – Connect & Collaborate）為題，揭示了工業4.0的下一階段。…
APeJ spending on mobility solutions is expected to grow 5.3% year over year in 2018, reaching more than $540.7 Billion, …
congatec Powers Luxoft (2018.03.15)
congatec and global IT service provider Luxoft introduce a next-gen automotive platform with SMARC 2.0 Computer-on-Modul…