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Telink Semiconductor to Demonstrate Its Smart Solutions at Bluetooth Asia 2017 in Shenzhen

Published: Sep 18,2017

Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017 conference taking place in Shenzhen, China on 26-27 September 2017.

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