Flip-Chip Flux NC-26-A is intended to be used in a nitrogen reflow environment of 100ppm oxygen or less. Some applications can utilize this material in an air environment, although best results will be obtained in an inert atmosphere.

Flip-Chip Flux NC-26-A can be used on many surface finishes including immersion Ag, Cu, and AuNi. These surfaces can be soldered with SnPb or Pb-free alloys, but require nitrogen if reflow temperatures exceed 240°C.

It will have strong adhesion to epoxy-based underfill materials, especially epoxy-amine and epoxy-acid based chemistries, should also be suitable for use with many epoxy-anhydride systems.

Flip-Chip Flux NC-26-A is designed for no-clean applications. If necessary, the flux can be removed by using a commercially available flux cleaner. Please contact an Indium Corporation Technical Service Engineer for recommendations of cleaners to suit your process needs.

Features:

－ Designed for flip-chip dipping applications

－ Tackiness suitable for holding die during assembly

－ Bubble-free airless packaging

－ Ultra-low residue

－ Halogen-free

－ No-clean