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New Generation DUSLIC XS Provides Single or Dual Voice Lines in Home CPE

Published: Oct 24,2014

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Lantiq announced its next generation voice line termination chip for customer premise equipment (CPE) designs. Continuing a track record of innovation, the new DUSLIC™XS reduces the cost for CPE manufacturers to provide wideband-capable voice telephony with fewer external components than any alternative and with a best-in-industry stand-by power figure of less than 20mW (50 percent less than competitor ICs)

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DUSLIC XS is the optimum solution to implement dual- or single-line analog phone services on any fiber, cable, LTE or xDSL home gateway device. In addition to the lowest part count and lowest power consumption, the chip integrates automated line testing capabilities that far exceed the requirements of GR.909.

Johannes Eiblmeier, vice president, and head of the Voice and Telecom Products Business Line said,“The latest generation of our DUSLIC family again sets the benchmark for CPE voice line termination. One example is the combined DC/DC mode, which allows use of a single power converter to support two voice lines while still achieving exceptional power consumption to readily meet the stringent requirements defined in the European Code of Conduct (CoC).”

Features:

- Twenty percent smaller than predecessor – Single-package, cost and footprint optimized CODEC/SLIC solution for implementation of the FXS (Foreign Exchange Subscriber) interface required to support analog fixed line phone service, available in an 8x8 mm package for dual or single-voice line, or single-line chip in 7x7 mm package.

- Most cost efficient solution in the market – Bill-of-Material (BOM) cost below US 20 cents for dual-line termination achieved through integration and elimination of duplicated external components (i.e., power conversion and protection circuits) required for alternative dual-line designs.

- CO-grade transmission performance and operation in industrial temperature range with wideband support (16 kHz, 16 bit linear), automatic ring current regulation, DTMF generation and detection, and caller ID generation.

- Reference designs for 2-layer board solutions, including schematics and List of Material (LOM) for various applications (PnP, NMOS, flyback, -48V buck/boost, low input voltage etc.).

- Integrated line testing features include Capacitance Measurement, Phone Detection Test, AC Level Metering, Make-and-Break Dial Tone Test, and Universal Tone Detection Test.

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