The LPS22HB is not only the world's smallest pressure sensor, but also the only one offered in a fully molded package that provides the best thermal and mechanical robustness (high shock survivability > 20,000 g) while boosting the performance and offering the best trade-off between current consumption and noise.

This is because it is built using ST's new MEMS technology called "Bastille" that allows the use of fully molded HLGA (Holed Land Grid Array) packages, resulting in the smallest footprint measuring just 2x2 mm and reaching thinness below 0.8mm.

Already proven in ST's LPS25HB 2.5 x 2.5mm pressure sensor, this revolutionary technology eliminates the need for a metallic or plastic cap, as well as any additional mechanical grid for isolation, as it is dust-free and water-resistant by design.

"Leveraging our proprietary industry-leading MEMS technology, our advanced packaging expertise, and our ASIC design skills, ST has created in the LPS22HB a unique pressure sensor housed in a fully molded package with a volume of only 3mm³," said Francesco Italia, General Manager, High-End Sensor and Analog Division, STMicroelectronics.

"Once again, we are raising the bar in sensors, enabling our customers to offer even more value to their own customers."

Key technical features of the new pressure sensor include enhanced temperature compensation that allows apps to perform consistently in changing environments, an absolute pressure range from 260 to 1260 hPa that covers all possible user altitudes (from the deepest mines to the top of Mount Everest), low power consumption less than 5uA, and pressure noise lower than 1Pa RMS.