The new Embedded Vision Development Kit takes advantage of the company’s smart connectivity and acceleration product lines, equipping customers with a comprehensive, integrated solution for developing designs and enabling faster time-to-market.

By combining the CrossLink pASSP mobile bridging device, ECP5 low power, small form factor FPGA, along with its high-bandwidth, high resolution HDMI ASSP, Lattice is offering an innovative solution that accelerates development of intelligent, vision-enabled devices at the edge.

The CrossLink input board includes dual-camera HD image sensors supporting the MIPI CSI-2 interface, eliminating the need for external video sources. The ECP5 base board enables low-power pre/post processing and includes support for HD image signal processing (ISP) intellectual property (IP) from Helion Vision.

Also included is a NanoVesta connector to support external image sensor video inputs. The HDMI output board based on the Sil1136 non-HDCP version enables connectivity to standard HDMI displays.

“As intelligence at the edge continues to increase, more applications will require integrated embedded vision technology,” said Deepak Boppana, director, product marketing at Lattice Semiconductor. “Our Embedded Vision Development Kit accelerates the adoption of mobile-influenced technology for applications including machine vision, smart surveillance cameras, robotics, AR/VR, drones and Advanced Driver Assistance Systems (ADAS).”