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Longsys Introduces World-First 11.5x13mm NVMe BGA SSD Drives

Published: Aug 11,2017

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Longsys announced expansion of its DRAM-less SSD product line from Serial ATA (SATA) interface to Non-Volatile Memory Express (NVMe) interface. Boot Partitions, an NVMe revision 1.3 feature, integrates BIOS/UEFI system inside an SSD and gives the host an option to simplify system design without SPI Flash.

Host Memory Buffer (HMB) feature enables DRAM-less SSDs to use host memory and achieves performance comparable to SSD designs with embedded DRAM but at much lower cost and power consumption. Powered by Marvell’s 88NV1160 SSD controller, the Longsys P900 marks the industry’s first SSD that supports small 11.5mmX13mm BGA SSD with HMB.

Furthermore Longsys is collaborating with other leaders in the ecosystem to accelerate the adoption of HMB-enabled SSDs for a new generation of low power, small form factor mobile computing systems.

Longsys’ P900 is the world’s first 11.5mmX13mm NVMe BGA SSD for mass market mobile computing solutions. The SSD is powered by Marvell’s 88NV1160 DRAM-less controller which integrates Marvell’s industry-leading NANDEdge low-density parity check (LDPC) error-correction technology supporting triple-level cell (TLC) and 3D NAND.

The Longsys P900 BGA SSD enables small form factor SSD solutions with unparalleled performance for integration into low-z-height tablets, Chromebooks, new 2-in-1 hybrid/detachable mobile PC platforms, virtual reality (VR) and automotive applications, and supports PCIe 3.0X2 and the new NVMe HMB feature.

By leveraging memory allocated from the host system, the Longsys P900 BGA SSD is able to scale up performance without limitations of conventional DRAM-less architectures. The P900 series can support Boot Partitions, which is equivalent to integrating BIOS/UEFI system inside SSD with no need of SPI Flash to simplify system design.

The P900 SSD series will be available in 480GB, 240GB, 120GB and 60GB. Longsys will provide samples to customers in Q4 2017 and ship to major customers in Q1 2018.

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