? CTIMES Technology - HOLTEK New BS45F3232 Proximity Sensing MCU
Taipei, Wednesday, Jan 16, 2019, 11:29

Technology Front

HOLTEK New BS45F3232 Proximity Sensing MCU

Published: Nov 19,2018

207 Read

Holtek announced the release of its new proximity sensing MCU, the BS45F3232. As the device includes an integrated active IR proximity sensing circuit in a 16-pin QFN (3×3) small package type, it is extremely suitable for use in proximity sensing related products/modules where space is limited such as sanitary products, home appliances, security products to name but a few.

More on This

HOLTEK New HT68F0021/HT68F0031 Cost-Effective MCUs

Holtek wishes to announce two new additions to its Cost-Effective Flash MCU range with the release of the HT68F0021 and HT68F0031 devices...


In expanding its presence in the Brushless DC Motor controller application area, Holtek is delighted to announce its new BLDC Flash type MCU, the HT66FM5340...

The device includes an integrated active IR proximity sensing circuit which greatly reduces the required number of external components, such as operational amplifier, D/A converter, transistors, resistors and capacitors, thus reducing product area size and BOM costs. The device transmitting power and receiving sensitivity can also be controlled using the application program.

With its integrated EEPROM, which can store application parameters, auto adjustment and calibration functions can be easily implemented. The sensing distance can be also adjusted by the application program as well as having simple development and production features. There is a full range of communication interfaces, including UART, I2C and SPI, which offer a high level of flexibility for communication with different devices, such as MCUs, wireless transmission modules, etc.

The device includes a Flash Program Memory capacity of 2K×14, a Data Memory capacity of 64 bytes, a true EEPROM Memory capacity of 32 bytes and a 12-bit A/D Converter. With regard to packaging, the device is supplied in 8-pin SOP, 16-pin NSOP and 16-pin QFN (3×3) package types.