u-blox Positioning Solutions Available on NVIDIA Jetson Edge AI and DRIVE Hyperion platforms
u-blox has strengthened its contribution to the NVIDIA Jetson and NVIDIA DRIVE Hyperion platforms as part of its strategic growth initiative around high-precision positioning within the industrial and automotive markets. u-blox has joined the NVIDIA Jetson Partner Ecosystem, which delivers the power of modern AI for autonomous machines and other edge AI applications across all industrial markets...
Grundfos and YCM Partner to Accelerate Smart and Energy-Efficient Machine Tool
Grundfos Pumps and YCM (Yeong Chin Machinery Industries) have signed a Memorandum of Understanding (MoU) with the aim of accelerating the development of intelligent and energy-efficient systems in Taiwan's machine tool industry, thereby promoting environmental sustaina-bility...
NSTC Minister Meets with Czech Republic Minister of Science, Re-search and Innovation
NSTC Minister Cheng-Wen Wu met with Czech Republic Science, Research and In-novation Minister Marek Zeníšek in Prague to exchange views on future Taiwan-Czech scientific research cooperation. During this visit, which marked his first over-seas trip since taking office this May, Minister Wu participated in a semiconductor investment delegation led by Executive Yuan Secretary-General Ming-Hsin Kung...
ITRI to Cultivate Green Talents and Bridge Taiwan's Power Gap
In the face of the global net-zero trend and the rapid development of artificial intelligence (AI), stable and low-carbon electricity has become a major concern for countries worldwide, attracting many cross-domain enterprises to explore new business opportunities and creating a strong demand for green-collar talent...
mechatronic systemtechnik GmbH Unveils Its New Technology Center in Fürnitz
mechatronic systemtechnik GmbH (mechatronic) announces the opening of its new cutting-edge technology center in Fürnitz. An investment exceeding EUR 20 million in value, the new facility spans 6,500m2 across three storeys and includes a progressive clean room and laboratory, which are central to the planning, development, and production of the company’s advanced systems...
PICMG COM-HPC 1.2 Mini Brings PCIe 5.0, USB4 & 10 GbE to Far Edge
PICMG has announced the release of the COM-HPC 1.2 “Mini” specification. Measuring just 95 mm x 70 mm, COM-HPC Mini is nearly half the size of the next-smallest COM-HPC form factor and provides a cost-effective, lower power module for autonomous mobile robots, drones, mobile 5G test and measurement equipment, and other far edge applications...
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