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Mini LED sees Potential in Backlighting and Digital Display, TrendForce Says
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Published: Dec 04,2017
Industrial 3D Printer Market Growing 27% in 2017, Says The Information Network
Industrial 3D printers are slated to grow 27% in 2017, lifted by sales by Hewlett-Packard, according to the Information Network, a New Tripoli-based market research company. 3D printers are segmented in this report as Industrial and Consumer...
Synopsys Delivers a Complete HDMI 2.1 IP Solution with HDCP 2.2 Content Protection
Synopsys announced its complete DesignWare HDMI 2.1 IP solution with High-Bandwidth Digital Content Protection (HDCP) 2.2 consisting of controllers, PHYs, verification IP, IP Prototyping Kit, and IP Subsystem as well as Linux software drivers...
Vangochip Technology Delivers Wi-SUN Certified Sub-GHz RF Platform
HSINCHU, Taiwan - Vangochip Technology today announced its first-gen sub-GHz RF family VC7000 passed the Wi-SUN Alliance PHY Certification. Wi-SUN Alliance PHY Certification Program includes: PHY Conformance Testing based on IEEE 802...
DENSO and NEC Establish a JV to Develop Essential Connectivity Technologies for Cars
DENSO and NEC Platforms, Ltd., a subsidiary of NEC Corporation, today unveiled a new joint venture, DENSO NEXT CO., LTD. The company will develop in-vehicle information and communications equipment critical for fostering a truly connected environment inside vehicles...
Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology
Samsung Electronics today announced that its Foundry Business has commenced mass production of System-on-Chip (SoC) products built on its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus). 10LPP process technology allows up to 10-percent higher performance or 15-percent lower power consumption compared to its first generation 10nm process technology, 10LPE (Low Power Early)...
Four Macronix Technical Papers Selected for 2017 IEDM
HSINCHU, Taiwan - Macronix International today announces that it has four technical papers selected for presentation at 2017 IEEE International Electron Devices Meeting (IEDM) which is taking place in San Francisco, USA from December 2-6...
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