SFP-DD MSA Define Specification for New Small Form-Factor Pluggable Interface
The SFP-DD Multi-Source Agreement (MSA) Group has announced intent to develop the specification for a high-speed, double-density small form-factor pluggable (SFP-DD) interface. Under the MSA, participating companies will address the technical challenges of achieving a double-density SFP interface and ensuring mechanical interoperability for module components produced by different manufacturers...
Semiconductor Content in an Electronic System will reach 28.1% in 2017, Says IC Insights
IC Insights forecasts that the 2017 global electronic systems market will grow by only 2% to $1,493 billion while the worldwide semiconductor market is expected to surge by 15% this year to $419.1 billion. Moreover, IC Insights forecasts that the total semiconductor market will exceed $500...
Server Shipments for 2H17 to Grow by 10%, Says TrendForce
Global server shipments fell in the first quarter of 2017 due to the seasonal effect on demand, according to the latest server market analysis by DRAMeXchange, a division of TrendForce. However, shipments rebounded in the second quarter and rose by about 10% compared with the first quarter...
China to Add Most of the 200mm Capacity Through 2021 with 34% Growth, Semi Report
SEMI issued an update to its 200mm Fab Outlook report, with improved and expanded report forecasting of 200mm fab trends out to 2021. SEMI’s analysts updated information on over 100 facilities, including the latest new facilities and investment projects in China...
Bridgetek launches two additional new development modules
Bridgetek has added two new development modules - the CleO35-WiFi module and the MM930LITE module, both designed to aid application development with the CleO35 and FT93x series respectively. The CleO35-WiFi module is a Wi-Fi accessory for the CleO series – the smart TFT display for Arduino...
Nichia Remained Revenue Leader in China’s LED Package Market for 2016
Steady growth in the LED lighting market supported the capacity expansion efforts of LED chip and package industries in 2016, says LEDinside, a division of TrendForce. Furthermore, the annual revenue of China’s LED package market grew by 6% for 2016 to reach US$8...
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