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REYAX Integrates u-blox Wireless & GNSS Modules Solution into Industrial Router Platform
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Published: Dec 07,2016
Micron to Establish 3D DRAM Packaging Plant in Taiwan
TAIPEI, Taiwan - According to Taiwan’s Economic Daily News, Micron Technology, Inc. has decided to establish their first overseas 3D DRAM memory packaging and testing plant in the Central Taiwan Science Park in Taichung, and Amkor’s former General Manager will serve as the Taiwan General Manager...
TrendForce Forecasts LCD TV Shipments to Expand by 2.5% in 2017
Shipments of LCD TV sets worldwide for 2016 are estimated to grow by 1.9% annually to around 220 million units, according to the latest analysis by WitsView, a division of TrendForce. At the start of 2017, the U.S. consumer market will be bumpy in the short term due to the results of the country’s presidential election...
NVIDIA, Yann LeCun Announce Deep Learning Teaching Kit for University Professors
With demand for graduates with AI skills booming, NVIDIA released its Deep Learning Teaching Kit to help educators give their students hands on experience with GPU-accelerated computing. The kit — co-developed with deep-learning pioneer Yann LeCun, and largely based on his deep learning course at New York University — was announced Monday at the NIPS machine learning conference in Barcelona...
AMD Extends Strategic Partnership with Mentor Graphics for Linux-based Embedded Solutions
AMD today announced a new three-year agreement to expand its strategic partnership with Mentor Graphics Corporation. The agreement continues AMD's relationship with Mentor Graphics, a world leader in electronic hardware and software design solutions, and reinforces AMD's commitment to offer greater choice for embedded developers when it comes to high-performance x86 architectures...
NFC Forum Innovation Awards Open for Submissions
The NFC Forum announced today a call for entries for the NFC Forum Innovation Awards to recognize innovative Near Field Communications (NFC) products, services and applications worldwide. Companies and developers using NFC in new...
MegaChips Adopts Omni Design’s Ultra-Low Power A/D Converter IP for Next-Gen Communication Networks
MegaChips Corporation and Omni Design Technologies, a provider of high-performance, ultra-low power semiconductor IP cores, today announced a strategic partnership for the development of high-performance, low-power analog front end (AFE) chips...
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