OSRAM and MLS to Carve Out Their Positions in LED Lighting Market with LEDVANCE Deal
German-based lighting manufacturer OSRAM has agreed to sell its lamp business unit LEDVANCE to a Chinese consortium that is led by IDG Capital Partners and includes LED manufacturer MLS and Yiwu State-Owned Assets Operation Center...
FOVE to Debut Its Industrial Eye-tracking VR Headset
FOVE Inc. announced today that they will be debuting the new industrial design for their eye-tracking VR headset this month in southern California. Set to premier at both Comic-Con and SIGGRAPH2016, FOVE’s new design showcases the company’s continued emphasis on bringing eye-tracking to virtual reality while remaining a lightweight VR headset...
Keysight Joins Next-Gen Mobile Networks Alliance to Advance 5G Technology
Keysight Technologies today announced that it has joined the Next Generation Mobile Networks (NGMN) Alliance. As a member of NGMN, Keysight will work closely with the growing community of innovative global mobile network operators, manufacturers and research institutes involved with 5G development and deployment...
Toshiba Starts Sample Shipment of 64-Layer 3D Flash Memory
Toshiba Corporation today unveiled the latest generation of its BiCS FLASH three-dimensional (3D) flash memory with a stacked cell structure, a 64-layer device that will be first in the world to start sample shipments today. The new device incorporates 3-bit-per-cell (triple-level cell, TLC) technology and achieves a 256-gigabit (32-gigabytes) capacity, an advance that underscores the potential of Toshiba’s proprietary architecture...
WD Announces World’s First 64 Layer 256GB 3D NAND Technology
Western Digital today announced that it has successfully developed its next generation 3D NAND technology, BiCS3, with 64 layers of vertical storage capability. Pilot production of the new technology has commenced in the Yokkaichi, Japan joint venture facilities and initial output is expected later this year...
Montage Rolls Out the World's First Gen2+ DDR4 RCD Capable of DDR4-3200
Montage Technology Group Limited ("Montage") today announced its roll-out of the world's first Gen2+ DDR4 Registering Clock Driver (DDR4RCD02+) capable of DDR4-3200, and the successful validation of its Gen2 DDR4 Registering Clock Driver (DDR4RCD02) and Data Buffer (DDR4DB02) products for DDR4 server platforms...
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