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EXPEC Becomes Taiwan’s First Company to Obtain PS4 VR Certification

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Published: Jun 16,2016

 

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Smallest 3D Camera Brings AR to a Smartphone

Lenovo is the first manufacturer worldwide to bring Tango technology to a consumer product. Google's technology that allows devices to understand spatial information is an exclusive feature in the PHAB2 Pro smartphone launched today...

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Billion Electric Collaborates with Intraix to Conclude Smart Metering Project in Singapore

Billion Electric partners with Intraix, a Singaporean tech startup dedicated to the development of Smart Home Energy Management applications, to assist NEA (National Environment Agency) on facilitating the national policy of restricting carbon emission on home appliances through an effective intelligent energy management solution...

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Scale of Chinese LED Package Market to Expand by 5% Annually in 2016

The scale of China’s LED package industry grew just 2% annually to US$8.8 billion in 2015, according to the 2016 Chinese LED Chip and Package Industry Report by LEDinside, a division of TrendForce. The weak performance of the Chinese LED industry last year was mainly attributed to the global economic slowdown...

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UTAC, Sarda and AT&S Collaborate in Delivering Small, Fast Voltage Regulators

Sarda Technologies (Sarda) and UTAC Holdings Ltd (UTAC) today announced that Sarda will implement its Heterogeneous Integrated Power Stage (HIPS) in UTAC’s three-dimensional system-in-package (“3D SiP”) based on ECP technology from AT&S to improve data center's energy efficiency...

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Smartphone Technologies Can Not Be Ignored

The smartphone market is getting more complex and dynamic, as well as maturing and being highly commoditized. In such mature market, technology improvements in smartphone has brought incremental enhancements and these are often not perceived by users as critical for them...

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ARM Announces POP IP for Cortex-A73 on TSMC 16FFC Process

ARM announced the availability of ARM Artisan physical IP, including POP IP, for mainstream mobile SoCs based on the new ARM Cortex-A73 processor on the TSMC 16FFC (FinFET Compact) process. The third-generation Artisan FinFET platform is optimized for TSMC 16FFC process and will enable ARM SoC partners to design the most power-efficient...

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