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European Broadband Connectivity to Soar Over the Next Five Years, Ovum Says
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Published: Mar 16,2016
Sales of MEMS-based Products to Rise 4.4% in 2016, IC Insights Reports
According to IC Insights, in 2015, nine product categories within the optoelectronics, sensors/actuators, and discretes (O-S-D) marketplace reached record-high sales compared to seven in 2014 and six in 2013. And sales of MEMS-based products are forecast to rise 4...
ARM, TSMC Announce Multi-year Collaboration on 7nm FinFET
HSIHCHU, Taiwan – ARM and TSMC announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute SoCs. Additionally, the agreement extends previous collaborations on 16nm and 10nm FinFET that have featured ARM Artisan foundation Physical IP...
COMPUTEX Issues Last Call for 2016 d&i Awards
TAIPEI, Taiwan － COMPUTEX TAIPEI today announced last call (submission deadline is March 31) for companies interested in submitting their products for the ninth annual d&i (design and innovation) awards. Technology companies throughout the world are invited to submit their products for review, and award submission is not limited to COMPUTEX exhibitors or attendees...
TAICS Signs Agreement with NGMN for 5G Cooperation
TAIPEI, Taiwan － TAICS (Taiwan Association of Information and Communication Standards), and NGMN(Next Generation Mobile Networks) today signed a agreement at Taipei 5G Summit. Two sides committed to co-develop 5G technology...
Delta Unveils Modular 500kVA UPS and 120kW RowCool at CeBIT 2016
Delta unveiled today, at DatacenterDynamics CeBIT 2016, new power and cooling technologies with industry-leading power capacity for high-density and large-scale green datacenters. Delta debuts the Modulon DPH series 500 kVA modular UPS featuring both the world’s highest power capacity and power density per module at 55kVA and 22...
ASE Showcases Its Leading IC Assembly Technology at SEMICON China 2016
TAIPEI, Taiwan － Advanced Semiconductor Engineering, Inc (ASE), announced it will be showcasing its System in Package (SiP) solutions in consumer and automotive applications at SEMICON China, scheduled to take place in Shanghai, China, from March 15 to 17, 2016...
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