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Synopsys Successfully Tapes Out Broad IP Portfolio for TSMC 10-nm FinFET Process
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Published: Sep 18,2015
Cadence SiP and PVS Technologies Enabled for TSMC InFO Packaging Technology
Cadence Design Systems today announced that its Allegro System-in-Package (SiP) and Physical Verification System (PVS) implementation technologies have been enabled for TSMC’s Integrated Fan-Out (InFO) packaging technology. By providing an integrated solution that automates the design-rule checking (DRC) flow, the Allegro SiP design tools and PVS enable TSMC customers to shorten the InFO design and verification cycle...
The Largest-Ever Layoffs of the Company, Epistar to Layoff 65 Employees
TAIPEI, Taiwan — The largest-ever layoffs of the company, Epistar Co., the nation’s No. 1 LED chipmaker is going to layoff 65 employees next week. As a matter of fact, it’s been viewed as a way to response to the emerging “Red Supply Chain” from China...
EPDs Back on Track, E Ink’s August Revenue Grows 29%
TAIPEI, Taiwan － Benefit from the increasing of shipments of new e-readers products, coupled with the stable shipments of smartbands and other wearable devices, Electronic Paper Display(EPD) suppliers E Ink’s Q3 revenue bounced up sharply, its August sales rushed to NT$1...
Foxconn Raising Share of Automation Involvement in Pepper Robot Assembly
According to the Topology Research Institute (TRI), a division of TrendForce, the combined rental and sales volume of Pepper a humanoid intelligent robot developed by Japanese telecom giant Softbank, will reach 27,000 units by 2018, with almost 90% of the customer base made up of general consumers...
Brotherliness, The Emotional Part Behind the Foxconn-SPIL Alliance
TAIPEI, Taiwan － Foxconn signed yesterday formally the cooperation agreement with SPIL, Taiwan's semiconductor assembly manufacture, realizing the oral commitment to legal document. The business benefit indeed exists, however the emotional part behind the agreement is the righteousness, or called Taiwanese brotherliness...
Foxconn, SPIL Announce Collaboration on Smartphone Subsystem Packaging
TAIPEI, Taiwan － Siliconware Precision Industries Co., Ltd(SPIL). Chairman of the Board Lin Bough and Hon Hai/Foxconn Chairman Terry Guo yesterday together attended an Association Press Conference to explain Foxconn and SPILS’ collaboration strategy on smartphone subsystem package technology while also imploring shareholders not to sell their stocks to ASE...
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