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Imec and Tokyo Electron Demonstrate Electrical Advantages of Direct Cu Etch Scheme
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Published: May 21,2015
MediaTek Climbs Into Top 10, UMC Enters Top 20 of Semiconductor Suppliers
IC Insights today announced a updata of the top 25 1Q15 semiconductor suppliers report. The top-20 ranking includes three pure-play foundries (TSMC, GlobalFoundries, and UMC) and four fabless companies. It is interesting to note that the top four semiconductor suppliers all have different business models...
Qisda Expands Its Industrial PC Capabilities By Buying DFI
TAIPEI, Taiwan － Qisda, a Taiwanese ODM/OEM services provider, yesterday announced that the company has bought 8.7% shares of DFI, a Taiwanese high-performance computing technology supplier, a total of NT$450 million by NT$45 per share, to increase its technological capabilities in the field of industrial PCs...
Taiwanese Startups to Debut at COMPUTEX 2015
TAIPEI, Taiwan - To promote the international awareness of Taiwan’s startups, the National Development Council(NDC) and Epoch Foundation will introduce “Meet The Future” innovation and startups theme pavilion at Computex TWTC Hall 3 during June 2 to June 6, 2015...
CES Asia Announces Suning’s Sun Weimin as Keynote Speaker
TAIPEI, Taiwan — CES AsiaTM on May 20 announced that Sun Weimin, Vice Chairman of Suning Commerce Group Co., will round out the list of keynote addresses at the inaugural CES Asia. Suning’s keynote will focus on the transformation of traditional retail enterprises toward Internet retail...
Smartphone Display Panel Shifting to High-Res, High-Performance Technologies
According to IHS, ongoing improvements in smartphone display performance is leading to increasing demand for high-resolution panels with lower power consumption requirements, which are not supported by the most common legacy technologies (non-crystalline thin-film silicon or a-Si for short)...
New Approach to Pave the Way for Advanced Interconnects
During the IEEE IITC conference in Grenoble, the nanoelectronics research center imec and Lam Research Corporation today presented a novel bottom-up prefill technique for vias and contacts. The technique, based on Electroless Deposition (ELD) of Cobalt (Co) is a highly selective method resulting in void-free filling of via and contact holes...
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