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Class-Leading Miniature Pressure Sensor Powers Mobile Innovation

Published: Mar 14,2014

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Demands for new and better smartphones and tablets will accelerate the global market for pressure sensors like the LPS25H to $375 million by 2017 for consumer electronic applications, according to IHS1.

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The sensors improve indoor navigation, enabling accurate floor detection and enhanced location-based services. Barometric pressure data also aids dead-reckoning calculations and opens the door to new smartphone apps such as weather analyzers and health and sports monitors.

The LPS25H is a MEMS (Micro-Electro-Mechanical Systems) sensor, benefiting from ST’s position as the world’s top MEMS supplier and owner of over 900 MEMS-related patents and patent applications worldwide. The unique features of this sensor include enhanced temperature compensation which allows apps to perform consistently in changing environments.

In addition, auto-zero capability allows instant accuracy upon entering a building together with additional value-added features like thresholds and interrupts.. In addition to mobile applications, ST’s LPS25H is also used in wearable, industrial, and smart-home systems.

Commenting on the first design wins by the LPS25H, Francesco Italia, General Manager, High-End Sensor and Analog Division, STMicroelectronics, said, “ST’s new pressure sensor combines advanced functionality and best-in-class quality, giving our customers the confidence to deliver innovative new products to market ahead of the curve. We expect new smartphones containing the LPS25H to enjoy considerable success, offering great features that deliver significant added value for end users.”

The tiny 2.5mm x 2.5mm x 1mm sensor occupies minimal space and has very low operating current of 4µA to preserve battery life. Ultra low-noise design helps ensure accuracy to within ±0.2mbar.

Features

• 260 to 1260 hPa absolute pressure range

• High-resolution mode: 1 Pa RMS

• Low power consumption:

• Low resolution mode: 4 μA

• High resolution mode: 25 μA

• High overpressure capability: 20x full scale

• Embedded temperature compensation

• Embedded 24-bit ADC

• Selectable ODR from 1 Hz to 25 Hz

• SPI and I²C interfaces

• Embedded FIFO

• Supply voltage: 1.7 to 3.6 V

• High shock survivability: 10,000 g

• Small and thin package

• ECOPACK lead-free compliant

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