Taipei, Thursday, Jun 27, 2017, 03:08

More ICs Solutions

GUC Successfully Rolls out HBM2 Total Solution (2017.06.19)

HISNCHU, Taiwan – Global Unichip, the custom ASIC company, has successful taped out a 16nm, second-generation High Bandwidth Memory (HBM) PHY and controller with verified interposer design and CoWoS Package. The innovative ultra-high capacity memory ASIC solution will meet the demanding requirements of artificial intelligence (AI), deep learning (DL), and a variety of high performance computing (HPC) applications...

Imec Develops 200V/650V Dispersion Free Normally-off/e-mode Power Devices on 8-inch Si Wafers (2017.06.13)

Imec announced today that it has developed 200V and 650V normally-off/enhancement mode (e-mode) on 200mm/8-inch GaN-on-Silicon wafers, achieving a very low dynamic Ron dispersion (below 20 percent) and state-of-the-art performance and reproducibility...

Imec Achieves Record-Low Source/Drain Contact Resistivity for PMOS Transistors (2017.06.08)

At this week’s 2017 Symposia on VLSI Technology and Circuits, imec, the world-leading research and innovation hub in nano-electronics and digital technology, reported record breaking values below 10^-9 Ohm.cm² for PMOS source/drain contact resistivity...

Asia Pacific Microsystems Will Exhibit at Transducers 2017 in June (2017.06.07)

TAIPEI, Taiwan - Asia Pacific Microsystems, Inc. (APM), "Paving the way toward MEMS production", will exhibit at Transducers 2017 at Kaohsiung Exhibition Center from June 18th to 22th. Transducers 2017 is co-sponsored by IEEE Electron Devices Society (EDS)...

IBM, GLOBALFOUNDRIES and Samsung Builds New Transistor for 5nm Technology (2017.06.06)

IBM, its Research Alliance partners GLOBALFOUNDRIES and Samsung, and equipment suppliers have developed an industry-first process to build silicon nanosheet transistors that will enable 5 nanometer (nm) chips. The resulting increase in performance will help accelerate cognitive computing, the Internet of Things (IoT), and other data-intensive applications delivered in the cloud...

Worldwide Semiconductor Manufacturing Equipment Billings Reached US$13.1 billion for Q1 (2017.06.06)

SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$13.1 billion for the first quarter of 2017. The quarter ended very strong, with March billings reaching $5.6 billion, an all-time monthly record...

Q1 2017 Taiwan IC Revenue Decline 11.3% On-quarter (2017.05.19)

The TSIA survey showed that Q1 2017 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$571.4 billion(US$18.3B) (11.3% decline on-quarter and up 5.0% on-year). Separately, with NT$139...

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