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Automotive and IoT Will Drive IC Growth Through 2021, IC Insights Says (2017.12.07)

Integrated circuit sales for automotive systems and the Internet of Things are forecast to grow 70% faster than total IC revenues between 2016 and 2021, according to IC Insights’ new 2018 Integrated Circuit Market Drivers Report...

China’s IC Design Industry Revenue Grows by 22% in 2017, TrendForce Reports (2017.12.06)

According to the latest report of TrendForce, China’s IC design industry revenue will reach RMB 200.6 billion in 2017, a yearly growth of 22%. The growth rate is expected to remain at around 20%, totaling RMB 240 billion in 2018, pointed out by Cici Zhang, analyst of TrendForce...

TSMC to Hold Supply Chain Forum This Week to Announce 7nm Manufacturing Process Schedule (2017.12.05)

TAIPEI, Taiwan - Taiwan Semiconductor Manufacturing Company, Limited (TSMC) on December 7 of this week will hold a supply chain forum. It is unusual for TSMC to hold this kind of event twice in a year. At the supply chain forum this time, co-CEO Mark Liu will deliver a keynote speech, and he is expected to announce both the 7nm volume production process as well as the 5nm progress of 5nm trial production and production...

Semiconductor Industry Continues Upward Trend Toward Record Year, IHS Markit Says (2017.12.04)

The semiconductor industry continued its upward trend in the third quarter of 2017, notching 12 percent sequential growth with strength across all application markets, according to IHS Markit. Global revenue totaled $113.9 billion, up from $101...

Vangochip Technology Delivers Wi-SUN Certified Sub-GHz RF Platform (2017.11.29)

HSINCHU, Taiwan - Vangochip Technology today announced its first-gen sub-GHz RF family VC7000 passed the Wi-SUN Alliance PHY Certification. Wi-SUN Alliance PHY Certification Program includes: PHY Conformance Testing based on IEEE 802...

Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology (2017.11.29)

Samsung Electronics today announced that its Foundry Business has commenced mass production of System-on-Chip (SoC) products built on its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus). 10LPP process technology allows up to 10-percent higher performance or 15-percent lower power consumption compared to its first generation 10nm process technology, 10LPE (Low Power Early)...

ASE to Enlarge High-End Packaging Plant in Kaohsiung (2017.11.28)

TAIPEI, Taiwan - The ASE Group is the largest semiconductor packaging manufacturer globally and will expand their high-end packaging production capacity in their planned Kaohsiung high-end packaging plant. Furthermore, they have already formally submitted their requirements for land to the Ministry of Economic Affairs and Kaohsiung City Government...

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