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SiP and Heterogeneous Integration as Key Driving Force of Growth for IC Packaging and Testing (2020.02.03)

TAIPEI, Taiwan - Amid continued economic uncertainty and high inventory levels, growth of the worldwide IC packaging and testing industry is expected to slow down, and the worldwide IC packaging and testing industry shipment value is estimated to reached US$29...

Semiconductor R&D To Nudge Higher Through 2024 (2020.02.03)

The semiconductor business is defined by rapid technological changes and the need to maintain high levels of investment in research and development for new materials, innovative manufacturing processes for increasingly complex chip designs, and advanced IC packaging technologies...

eMemory and UMC Qualify NeoFuse IP on the Foundry’s 28nm High Voltage Process (2020.01.20)

HSINCHU, Taiwan – eMemory and United Microelectronics Corporation today announced that eMemory’s NeoFuse IP has been qualified on UMC’s 28nm High Voltage (HV) platform to target the fast-growing OLED market. Key customers have completed successful product tape outs using this IP and process, which are ready for mass production...

Worldwide Semiconductor Revenue Declined 11.9% in 2019, Gartner Says (2020.01.17)

Worldwide semiconductor revenue totaled $418.3 billion in 2019, down 11.9% from 2018, according to preliminary results by Gartner, Inc. Intel regained the No. 1 position in the market as the downturn in the memory market negatively impacted many of the top vendors, including Samsung Electronics, the No...

TSMC Reports Fourth Quarter EPS of NT$4.47; Projects a Strong Outlook of 2020 (2020.01.16)

HSINCHU, Taiwan – TSMC today announced consolidated revenue of NT$317.24 billion, net income of NT$116.04 billion, and diluted earnings per share of NT$4.47 (US$0.73 per ADR unit) for the fourth quarter ended December 31, 2019...

Global OSAT Market Shows Signs of Recovery in 2H19, But Yearly Revenue to Decline Slightly (2019.11.20)

According to the latest research from TrendForce, the decline in the global OSAT industry showed signs of a gradual halt in 3Q19, since the drop in memory prices began to slow down, and smartphone sales steadily recovered. The top ten OSAT providers posted a total revenue of US$6 billion in 3Q19, a 10...

Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP (2019.11.18)

HSINCHU, Taiwan - Faraday Technology and United Microelectronics Corporation, today announced the availability of Faraday’s fundamental IP on UMC’s 22nm ultra-low-power (ULP) and ultra-low-leakage (ULL) processes. The silicon-proven 22ULP/ULL fundamental IP, including multi-Vt standard cell libraries, ECO libraries, IO libraries, PowerSlash kit, and memory compilers, offers significant power reduction for the next level of SoC design...

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