According to IC Insights’ new McClean Report that the world’s leading semiconductor suppliers significantly increased their marketshare over the past decade. The top 5 semiconductor suppliers accounted for 47% of the world’s semiconductor sales in 2018, an increase of 14 percentage points from 10 years earlier...

IC Insights said that the semiconductor industry is expected to allocate the largest portion of its capex spending for flash memory again in 2019, marking the third consecutive year that flash has led all other segments in spending...

HSINCHU, Taiwan - Faraday Technology Corporation today announced that it has won and delivered several factory automation (FA) related ASIC projects, supporting real-time Ethernet, EtherCAT, Profibus, and PLC controllers. In each case, Faraday employs its value-added ASIC and IP customization service for power-performance optimization and product lifecycle management to meet factory automation needs within Industry 4...

IC Insights pointed that with the recent rise of the fabless IC companies in China, the demand for foundry services has also risen in that country. In total, pure-play foundry sales in China jumped by 30% in 2017 to $7.6 billion, triple the 9% increase for the total pure-play foundry market that year...

TAIPEI, Taiwan - Taiwan's Environmental Administration yesterday approved the environmental assessment for Taiwan Semiconductor Manufacturing Company, Limited's (TSMC) 3-nanometer factory, signifying that TSMC's 3-nm factory will be able to commence operations on schedule in 2020 with total investment amounting to NT $600 billion...

HSINCHU, Taiwan–eMemory today announced that its NeoMTP, Multiple-Times-Programmable embedded non-volatile memory (NVM) IP, has been qualified on GLOBALFOUNDRIES (GF) 130nm BCDLite and BCD process technology platforms targeting both consumer power management and automotive AEC-Q100 Grade-1 compliant applications...

HSINCHU, Taiwan - Faraday Technology today announced the availability of its multi-protocol video interface IP on UMC 28nm HPC. The solution supports both transmitter (TX) and receiver (RX) featuring a reduced silicon footprint ideal for state-of-the-art panel and sensor interfaces, projectors, MFP, DSC, surveillance, AR and VR, and AI applications...