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TSIA Q1 2020 Statistics on Taiwan IC Industry (2020.05.18)

TAIPEI, Taiwan - The TSIA survey showed that Q1 2020 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$723.8 billion (US$23.4B) (4.0% decline on-quarter and up 28.3% on-year), with NT$174...

IC Unit Shipments Forecast to Display First-Ever Back-to-Back Decline (2020.04.23)

IC Insights forecasts that worldwide IC unit shipments will register their first-ever back-to-back annual decline in 2020. From 2013 through 2018, IC unit shipments were on a respectable growth path with an 8% increase logged in 2013, a 9% jump registered in 2014, a 5% increase displayed in 2015, a 7% increase shown in 2016, a double-digit growth rate of 15% in 2017, and a 10% increase in 2018...

Global IC Market Forecast Lowered From 3% to -4%, Says IC Insights (2020.04.12)

When 2020 started, global economic conditions pointed to single-digit percentage sales growth in the IC market after it fell by 15% in 2019, according to IC Insights. However, the world abruptly changed in 1Q20 with the rapid outbreak of the Covid-19 virus, which shut down nearly all countries and paralyzed global markets beginning in March 2020...

Samsung Announces Industry's First EUV DRAM with Shipment of First Million Modules (2020.03.25)

SamsungElectronics today announced that it has successfully shipped one million of the industry's first 10nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based on extreme ultraviolet (EUV) technology. The new EUV-based DRAM modules have completed global customer evaluations, and will open the door to more cutting-edge EUV process nodes for use in premium PC, mobile, enterprise server and datacenter applications...

Propelled by 51% Share of IDM Sales and 65% Share of Fabless Sales, U.S. Companies Captured 55% (2020.03.22)

Regional marketshares of IDMs (companies operating wafer fabs), fabless companies, and total IC sales were led by U.S. headquartered companies in 2019, according to data presented in the recently released March Update to The McClean Report 2020...

TSMC and NCTU Work on Wafer-scale One-atom-thick Insulating Layer Technology (2020.03.17)

TAIPEI, Taiwan - Under long-term support from the “Taiwan Consortium of Emergent Crystalline Materials” (TCECM) program of the Ministry of Science and Technology (MOST), Taiwan, a research team at National Chiao Tung University (NCTU) collaborated with Taiwan Semiconductor Manufacturing Company (TSMC) to form an industry-university joint research team, reporting a breakthrough in the synthesis of one-atom-thick boron nitride (BN)...

Imec demonstrates 24nm pitch lines with single exposure EUV lithography on ASML’s NXE:3400B scanner (2020.02.27)

This week, at the SPIE Advanced Lithography Conference, imec and ASML announce a breakthrough in printing narrow 24 nanometer (nm) pitch lines, corresponding to the dimensions of critical back-end-of-line metal layers of a 3 nm technology node process...

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