The top three countries in Asia Pacific excluding Japan (APeJ) that are the most capable and ready to generate efficiencies linked to IoT solutions are South Korea, Singapore and New Zealand, says a new IDC report. As expected, South Korea tops the Internet of Things (IoT) readiness index in APeJ...

u-blox announced the SARA R410M 02B, a configurable LTE Cat M1/NB1 multi mode module with worldwide coverage. It is the industry’s smallest module available in the market today, measuring just 16 x 26 mm, to offer both LTE Cat M1 and Cat NB1 in a single hardware package, as well as software based configurability for all deployed bands...

The new-generation Bluetooth Low Energy (BLE) System-on-Chip from STMicroelectronics is set to accelerate the spread of connected smart objects throughout homes, shopping areas, industry, toys and gaming, personal healthcare and infrastructure...

MediaTek unveiled its first narrow band Internet of Things (NB-IoT) System-on-Chip (SoC), the MT2625, and announced a collaboration with China Mobile to build the world’s smallest NB-IoT module (16mm X 18mm) around the chipset...

To cope with the trend of Industry 4.0 and IoT, Chroma's software and hardware technologies create a smart-factory platform, the Chroma MES, supporting big data through suitable solutions such as Smart Machine Interface (MI) and Fast Easy Player (FEP) for intelligent manufacturing...

China Mobile Communications Corporation and NTT DOCOMO, INC. announced today that they have jointly developed the world's first multi-vendor embedded subscriber identity module (eSIM) system within their commercial environments based on the GSMA's Remote Provisioning Architecture for Embedded UICC3...

HSINCHU, Taiwan – Andes Technology Corporation and M31 Technology today jointly announced that AndesCore N705 CPU had adopted M31’s low-power silicon IPs and Power Management Kit (PMK) to provide a very low power consumption CPU solution for SoC design in IoT and related low power applications...