With a 0.8mm square footprint and an off-board height of 0.35mm, the miniature 74AUP1G and 74LVC1G logic devices deliver significant space and weight savings to portable consumer electronic products, such as cell phones and tablets.

With its unique diamond pin configuration which maintains an equivalent lead

spacing of 0.5mm, the DFN0808 package removes the need for specialized

solder stencils. Diodes Incorporated is initially launching fourteen 74AUP1G

parts and eleven 74LVC1G parts in the new package option.

The 74LVC1G products operate over a wide supply range of 1.6V to 5.5V and will interface directly with TTL levels. While operating over a lower supply range, from 0.8V to 3.6V, the 74AUP1G products can achieve a lower power consumption to help boost battery cell lifetime.

Both of these industry-standard logic families feature the following functions:

AND, NAND, OR, XOR, inverters (simple, open-drain output and Schmitt trigger variants), and buffers (open-drain output, Schmitt trigger and tri-state output variants). NOR, AND with open-drain output, and a simple buffer are also available in the 74AUP1G logic family.