The Impel connector system delivers industry-leading low cross-talk and high density performance with data-rates up to 40 Gbps for next-generation backplane interconnect solutions. Because it meets all critical architectural needs, including conventional, co-planar, orthogonal midplane and orthogonal direct, it is ideal for telecommunications and data networking applications.

"With many of our customers designing new multi-generation system architectures that include multiple data rate increases over time, our goal was to develop a highly flexible, high-performance connector solution," said Zach Bradford, new product development manager, Molex.

"The Impel connector system provides the footprint and interface that allows users to migrate more easily and cost effectively to faster data rates without having to completely redesign their architecture or replace existing data center hardware."

The Impel conventional connector orientation, with a right angle daughtercard mating to a vertical header, provides 2 to 6 pair options to support price and performance. The 1.90mm conventional solution supports 80 differential pairs per linear inch and the 3.00mm conventional solution enables quad-route capabilities and a lower PCB layer count.

In these same configurations, the Impel connector system enables co-planar solutions, which support right angle daughtercard mating to right angle headers for added system scalability. The Impel backplane connector solutions for orthogonal architectures allow for 3 to 6 pair configurations, scaling from 18 to 72 differential pairs per node.

Featuring a third generation design, the Impel connector system also provides direct connection of PCBs in an orthogonal orientation to shorten system channel lengths, improve signal integrity channel performance, support open air-flow design and reduce applied cost.