The Lantiq VINAX dp chipset enables aggregated 300 Mbps over VDSL2 at distances up to 200m between a customer premise gateway and the fiber network distribution point.

Based on Lantiq’s carrier-grade VDSL2 chips developed for line card applications, the new chip set operates in industrial temperature ranges and the low power consumption of the FTTdp unit enables installation in outdoor boxes with passive cooling.

FTTdp is available today and a cost-effective alternative to Fiber-to-the-Home (FTTH) network topologies for many broadband access installations. FTTH requires the fiber to be deployed all the way into a customer’s premise, which is costly and may not be practicable in many scenarios.

Since it can be line-powered from the customer premise, the FTTdp unit can be placed conveniently in carrier managed locations, while on the subscriber end, the standard VDSL CPE and power feeder is self-installed.

Features:

－ Tightly integrated Lantiq carrier-class VDSL2 and GPON (FALC ON) solution

－ 300 Mbps aggregated data rate with G.INP (retransmission) downstream and upstream

－ Based on mature, future proof (VINAX CO platform) technology with demonstrated interoperability on both ends for GPON and VDSL links. Typical power consumption is 2.7 Watt for the VINAX dp chipset. The entire system consumes less than 6 Watts – including VDSL, GPON, DC/DC converter and all other active and passive components.