ICOP Technology President and CEO of the European Headquarters, Yin-Chen Chou, explains the benefits of these new SMARC and Qseven Computer-on-Modules: We see a strong trend towards small form factor system designs requiring a dedicated set of individually located I/O interfaces. Both QSeven and SMARC Computer-on-Modules deliver a sophisticated platform to meet this demand in a most efficient and highly cost effective manner.

Due to the die-integrated crossbar switch, the DMP Vortex SoC processors on SMARC and Qseven Computer-on-Modules can deliver very flexible I/O connectivity in combination with scalable ultra-low-power x86 performance which to date is unique in the entire x86 market. Consequently, DMP Vortex processor technology is a perfect fit for both the long tail x86 deployments as well as all the new upcoming Internet of Things-connected ultra- low-power appliances requiring bandwidths and performance that are tailored to manage multiple smaller package-sized applications which generate an abundance of valuable Big Data.

Engelbert Hörmannsdorfer, Chairman of the SGET e.V., welcomes ICOP Technology's design initiative to make DMP Vortex processor technology available on SMARC and QSeven Computer-on-Modules: By 2017, VDC predicts a CAGR of approximately 15% for the entire Computer-on-Module and COM carrier market. As SMARC and Qseven are the latest form factor standards in this area, here we expect to see a much higher CAGR within this period.

ICOP Technology's designs with DMP Vortex processor technology will make a valuable contribution to this growth and we envisage quite a few new application areas for this x86 processor performance class. Examples range from smart meters to smaller decentralized IoT data servers or edge devices which collect massive amounts of small data packages in the industrial fields and serve this to the industrial Internet of Thing clouds.

The new SMARC and Qseven modules from ICOP Technology fully comply with SGET specifications and are equipped with a soldered DMP Vortex86DX2 x86 System-on-Chip (SoC) with 800 MHz and 1 GB of DDR2 system memory. Designed for ultra low-power consumption, the new modules enable fanless and rugged designs in the extended temperature range from -20 °C up to +70 °C. Their integrated graphics support resolutions of up to 1280 x 1024 via VGA, LVDS and HDMI. Storage media can be connected via 1.5 Gbit/s SATA, SD and eMMC interfaces.

Further interfaces include GbE LAN and USB 2.0. Customer-specific extensions can be implemented via PCIe x1, SPI, I²C, and GPIO. HD Audio rounds off the feature set. The new modules offer a comprehensive OS support including DOS, Embedded Linux, X-Linux, QNX, VxWorks , FreeBSD as well as Microsoft Windows CE 6.0, Embedded Compact 7, Windows XP Professional, Windows Embedded Standard (XPE) and POS Ready (WePOS).