The new MIC45404 comes in a thermally enhanced package that incorporates inductors and passive components into a single, molded power converter. The slim 10 x 6 x 2 mm package saves space in customers’ designs, simplifies board design, and eliminates concern over passive components that may introduce unexpected electromagnetic interference (EMI).

“Eliminating the need to select key components and simplifying the board layout to meet EMI specifications are benefits that address requirements our customers have voiced,” said Keith Pazul, senior manager of Microchip’s Analog Power and Interface Division.

“Microchip’s low-profile MIC45404 is the newest extension of our power module product family that offers our customers one of the highest input voltage ratings and power densities available in the market.”

The MIC45404 incorporates one of the thinnest integrated magnetic inductors available in a 19V, 5A point-of-load buck converter. Integrated components include the controller, metal-oxide semiconductor field-effect transistors (MOSFETs), feedback path, and pulse width modulation (PWM) switching regulator.

The low profile of the MIC45404 module allows it to be placed on the back of a PCB, on a daughter card, or other placement where vertical height may be constrained in point-of-load power conversion, telecom and industrial applications.