Featuring up to 8 GB of dual-channel DDR3L-1333 memory onboard and optional eMMC support (up to 32 GB), SOM-3567 provides the ideal solution for battery-operated, thin, and compact installations, such as in-vehicle, medical, and industrial mobile computing devices.

Channel reservation between eDP and LVDS allows SOM-3567 to support dual displays in an legacy LVDS or advance eDP panels with HDMI/DP interfaces. SOM-3567 also supports 3D APIs which includes DX11, OGL3.2, OCL1.1, and hardware accelerators in H.264/AVC, VC-1, MPEG2, thereby enable high-resolution playback and graphics-intensive applications without substantial CPU load.

The SOM-3567 moduleprovides 3 PCIex1 Gen.2 5.0 GT/s by default and option to be 1 PCIe x4 whlie remove GbE supporting, allows a huge bandwidth for data transceiving.

It also features GbE, USB 3.0, 6 USB2.0 for for maximum connectivity. Due to the processor is natively support extended temperature, most components and especially key parts are design with extended tempertuare support, to benefit customer applications work under crucial environment more reliable.

To fulfill the ever-changing specialized demands for various applications, SOM-3567 is shipped with WISE-Paas/RMM kit in accessory box and an intelligent self-management agent with software control functions and standalone hardware design: iManager on board.

It’s a built-in solution chip, a perfect solution that provides a standardized, unified API,integrating several unique platform consolidating functions needed by embedded system integrators to improve consistency, reduce the developers’ efforts and make the product time-to-market. Most importantly, the standalone chip works individually to CPU core logic, that is, it’s an out-of-band control and not influenced by CPU loading providing reliable monitors and controls.