Target applications can be found wherever a small footprint matters and where the rich eco system of COM Express is key for engineers, as is the case for handheld and rugged mobile applications as well as stationary mini devices and IoT gateways. Mobile devices benefit from approximately 15% longer battery life while connected industrial devices benefit especially from the enhanced real-time capabilities. Impressive for all applications is the massively improved graphics performance that now also includes the support of 4k displays.

The new credit card sized congatec COM Express Mini modules are available with the power saving Intel Atom processors E3930, E3940 and E3950 for the extended temperature range of -40° C to +85° C, or are fitted with the more powerful low-power dual-core Intel Celeron N3350 and quad-core Intel Pentium N4200 processors. With up to 8 GB dual channel DDR3L RAM the modules offer best in class memory performance and significant bandwidth advantages compared to competing modules with only single channel memory.

They also feature the high-performance Intel Gen9 graphics which provides up to 18 execution units to support up to 2 independent displays via single channel LVDS/eDP and the digital display interface for DP 1.2 or HDMI 1.4b. For IoT connectivity and generic extensions, there are 1x Gigabit Ethernet interface, 4x PCIe 2.0 lanes and 8 USB ports, two of which are provided as USB 3.0. Additional peripherals can be connected via 1x SPI, 1x LPC, 4x GPIO and 2x serial UART interfaces. For the storage media, up to 128 GB of on board flash memory with fast eMMC 5.1, or 2x 6 Gbps SATA are an option. Audio signals are carried via HDA.

Software support is provided for Microsoft Windows 10, including the Microsoft Windows 10 IoT versions and all current Linux operating systems. The Board Support Package will also include support for the latest Wind River IDP 3.1. Customized integration support, a comprehensive range of accessories including cooling solutions and an evaluation carrier board as well as optional Embedded Design & Manufacturing services for application specific carrier board and system designs are also available.