For enterprise customers seeking to maximize the efficiency of their data centers, the new Acer Altos W2200h-W670h F4 can be configured with liquid cooling to support processors with a higher TDP (Thermal Design Power) and thereby lowering the PUE (Power Usage Effectiveness).

As an enhancement over previous generation multi-node servers, the W2200h chassis includes I/O cages for each of the compute nodes located at the rear. Each I/O cage includes two PCIe 3.0 x16 slots supporting low-profile/half-height cards, while the compute nodes include a front-facing slot, allowing each node to support three NVIDIA Tesla P4 inference accelerators (12 per chassis) or FPGA cards as needed.

Featuring dual Intel Xeon Scalable processors, each W670h F4 compute node supports up to 3 TB of DDR4 ECC 2666 MHz memory with 24 DIMM slots while two 2.5-inch SATA SSD drive bays are available with built in Intel RSTe RAID 0/1 support.

Connectivity includes dual port RJ45 10 GbE interfaces provided by the Intel Ethernet Controller X550, one 1 Gb management port, two USB 3.0 ports and a VGA port. In addition, the W2200h chassis supports a CMC (Chassis Management Controller) to simplify cabling and allows for easier installation and management.