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Technology Front

New Components for Smart Systems

Published: Jan 30,2019

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Würth Elektronik eiSos presents a wide variety of new electronic and electromechanical components at embedded world. A focus in the manufacturer’s extensive trade show program: sensors and wireless modules for embedded systems. In various forums at the trade show as well as in many presentations, technicians and developers from the leading European manufacturer of electronic and electromechanical components will inform about technological trends and new products.

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At embedded world, Würth Elektronik eiSos provides the first insights and outlooks on its new product family - Sensors: temperature sensors, absolute and differential pressure sensors as well as three-axis acceleration sensors. Moreover the proprietary module Thebe II, the WiFi module Calypso and the Bluetooth modul Proteus II represent the next represent the next step towards digital communication.

The wide bandwidth and high performance of the MagI³C power modules from Würth Elektronik eiSos are represented by MagI³C-VDRM (Variable Step Down Regulator Module). The compact step-down converter scores with integrated inductor and capacitors. Capacitors themselves are represented with no fewer than four different product series of H-Chip aluminum-polymer capacitors.

Miniaturization is an important topic for Würth Elektronik eiSos: With WE-CBF HF, the SMT ferrite for high frequency applications, tiny components make a huge impact on suppression. Further product highlights from the EMC specialists’ portfolio: WE-MAPI, one of the world’s smallest metal alloy power inductors, and WE-MCRI, an innovative, molded double choke. USB-3.1 type-C connectors with SuperSpeed technology are presented from the field of electromechanical components.

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