Technology Front
STMicroelectronics cooperates with Semikron to integrate silicon-carbide power technology
By Joanne Lin
Published: Jun 28,2022
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STM and Soitec Cooperate on SiC Substrate Manufacturing Technology
TAIPEI, Taiwan – STMicroelectronics (STM) and Soitec (Euronext Paris) announce the next stage of their cooperation on Silicon Carbide (SiC) substrates...
silicon carbide (SiC) technology for the eMPack electric-vehicle (EV) power modules from Semikron.This is the result of a four-year technical collaboration between the two companies to design-in ST’s SiC power semiconductors for superior efficiency and industry-benchmark performance in more compact systems.
SiC is quickly becoming the automotive industry’s
preferred power technology for EV traction drives, contributing to greater driving range and reliability.Semikron recently announced it had secured a billion-Euro contract to supply their innovative eMPack power modules to a major German car maker, beginning in 2025.
“ST’s industry-leading SiC device-manufacturing capabilities and in-depth expertise with the technology enabled us to integrate these cutting-edge semiconductors with our advanced manufacturing processes, which enhance reliability, power density, and scalability to meet the needs of the automotive industry,” said Karl-Heinz Gaubatz, Semikron Chief Executive Officer (CEO) and Chief Technical Officer (CTO). “As we now move towards volume-production, our collaboration with ST brings the assurance of a robust supply chain that gives control over quality and delivery performance.”
“Leveraging our SiC technology, Semikron’s advanced scalable eMPack family of power modules is ready to make a major contribution towards zero-emission motoring,” said Edward
Merli, Power Transistor Sub-Group General Manager and Executive Vice President of STMicroelectronics. “In addition to its transformative effect in e-mobility, our SiC technology, now in its third generation, is driving increased efficiency, performance, and reliability in sustainable energy and industrial power-control applications.”