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More IoTs Solutions

Renesas Electronics Delivers Game-Changing IoT Platform (2015.06.17)

Renesas Electronics announced the Renesas Synergy Platform, a new, easy-to-use, qualified platform designed to accelerate time to market, reduce total cost of ownership and remove many of the obstacles engineers face as they develop products for the growing Internet of Things (IoT) and industrial markets...

HomeKit solution for nRF51 Series Bluetooth Smart SoCs (2015.06.17)

Nordic Semiconductor ASA announced the availability of its HomeKit solution for the nRF51 Series Bluetooth Smart SoCs. Meeting the HomeKit technical specifications the complete solution offers simplified development and accelerated time to market for iPhone, iPad and iPod touch enabled connected home products...

MIC: Huawei’s ROADS Strategy Boosts IoT and Big Data Innovation (2015.06.12)

Huawei held the 11th Annual Global Analyst Summit on April 23, attracting over 500 analysts and business leaders from world-class companies such as BT, Intel and Volvo. Huawei's CEO announced the ROADS strategy, which stands for Real-time, On-demand, All-online, DIY (Do It Yourself) and Social...

Cadence Announces Collaboration with TSMC on IoT IP Subsystem (2015.06.08)

Cadence Design Systems today announced that it is collaborating with TSMC on the development of an Internet of Things (IoT) intellectual property (IP) subsystem demonstration platform for TSMC’s ultra-low power (ULP) process...

eMemory Launches Ultra-Low Power MTP Silicon IP for IoT Applications (2015.06.05)

HSINCHU, Taiwan – eMemory Technology announced today its newly developed ultra-low power Multiple-Time Programmable (MTP) silicon IP offers superior features including 3μW low power consumption, 0.7V low operation voltage, over 100,000 times endurance, compact size, and excellent cost advantages...

Industry Big Names Discuss Opportunities of IoT at COMPUTEX (2015.06.04)

TAIPEI, Taiwan- Today Taiwan External Trade Development Council implemented (organized by the Bureau of Foreign Trade, MOEA), a forum titled “IoT and the Cloud: Software to Hardware—The Next Step”. ACER founder Stan Shih, MediaTek CMO Johan Lodenius, ARM CMO Ian Drew, STMicroelectronics Executive Vice President François Guibert, and NXP R&D Executive Vice President Hai Wang were invited...

Intel Teams up with Taiwanese ICT Firms to Realize IoT (2015.06.03)

TAIPEI, Taiwan — Intel makes Internet of Things (IoT) is not only a concept that teamed up with Taiwanese ICT firms such as Nexcom International Co. and Formosa Plastics Co. to build the state-of-the-art smart factory, as well as cooperated with other companies in a bid to realize IoT in smart home, smart building, smart logistics and smart education, etc...

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