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Mitsubishi Electric’s New Plant in Gujarat, India to Produce Automotive Products
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Published: Oct 07,2019
Samsung Develops 12-Layer 3D-TSV Chip Packaging Technology with Over 60,000 TSV Holes
Samsung Electronics today announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung's new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips...
Prices of Some TV Panels Were Reduced Their Drop Scale and Might Stop Falling, Says TrendForce
According to WitsView, a division of TrendForce, its latest survey pointed out that TV panel prices had significantly dropped for 4 consecutive months since May. Prices of more than half of size segments have lowered to below cash costs...
TTA Startups Led by the MOST Won $125M Business Opportunities during the MedTech Conference 2019
Under the initiative of the Ministry of Science and Technology (MOST) of Taiwan, Taiwan Tech Arena (TTA) led 12 startups that have some of the best minds in medical technology to Boston. By showcasing their innovative tech solutions during the MedTech Conference 2019 (23-25, Sept...
M31 Won TSMC’s 2019 Partner of the Year Award for Specialty Process IP
HISNCHU, Taiwan – M31 Technology today announced that M31 Technology received “TSMC’s 2019 Partner of the Year Award for Specialty Process IP” at TSMC 2019 Open Innovation Platform Ecosystem Forum in Santa Clara, California...
Acer Notebook Designs, Including New ConceptD Creator Models, Win 2019 Good Design Awards
TAIPEI, Taiwan - Acer notebooks have earned the 2019 Good Design Award for outstanding design. Namely the new ConceptD 7 and ConceptD 9 for creators, and the Acer TravelMate P6 and the thin-and-light Acer Swift 7 for traveling professionals...
Andes Technology, Tiempo Secure Announce Strategic Partnership to Enhance RISC-V Platform Security
HSINCHU, Taiwan – Andes Technology Corporation, a leading supplier of outstanding efficiency, low-power, high performance 32/64-bit embedded CPU cores, including a broad family of RISC-V cores, has entered into a strategic partnership with Tiempo Secure...
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