Mitsubishi Electric Develops World's First Metal Corrosion Sensor for Mounting on PCB
Mitsubishi Electric announced today that it has developed what is believed to be the world's first* compact metal corrosion sensor small enough to be mounted on printed circuit boards. The new sensor utilizes metal corrosion monitoring technology developed by Mitsubishi Electric that detects the degree of corrosion of metal components caused by corrosive gases such as sulfur compounds in the atmosphere...
Samsung Introduces Its First 5G-Integrated Mobile Processor
Samsung Electronics announced its latest mobile processor, the Exynos 980, which combines best-in-class connectivity with an integrated 5G modem and intelligent processing performance in a single chip. “With the introduction of our 5G modem last year, Samsung has been driving the 5G revolution and paved the way towards the next step in mobility,” said Ben Hur, vice president of System LSI marketing at Samsung Electronics...
u-blox Acquires Rigado’s Bluetooth Modules Business and Extends Bluetooth Low Energy Offerings
u-blox announced it acquired Rigado’s Bluetooth modules business in an Asset Purchase Agreement. Rigado is a leading provider of Edge-as-a-Service gateway solutions for Commercial IoT, and began offering certified wireless modules in 2015...
TWCC Assists in Training AI Identification Made Entirely from Microslide Images
TAIPEI, Taiwan - Following the digitization of histopathological slides, the slides have extremely high resolutions with each digital microslide reaching billions or even tens of billions of pixels in resolution and the file sizes exceeding 10GB...
DOCOMO Joins 5G Alliance for Connected Industries and Automation
NTT DOCOMO announced today that it has joined the 5G Alliance for Connected Industries and Automation (5G-ACIA) with the aim of further advancing the use of 5G technology in the manufacturing sector. 5G-ACIA is a major global initiative encompassing some fifty companies from diverse industries around the world, including the telecommunication and manufacturing sectors...
Mitsubishi Electric Develops World's First Multi-Cell GaN-HEMT Bonded Directly to Diamond Substrate
Mitsubishi Electric announced today that in collaboration with the Research Center for Ubiquitous MEMS and Micro Engineering, National Institute of Advanced Industrial Science and Technology (AIST), it has developed a gallium...
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