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Avalue Smart Traffic Solution: AI Makes Effective Traffic Management Possible
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Published: Jun 27,2019
MediaTek Releases Helio P65 Chip for Smartphones with Upgraded Gaming Experience
TAIPEI, Taiwan – MediaTek today announced the release of its new smartphone chip, the Helio P65. The chip is built using a 12nm manufacturing process with a new octa-core architecture that enables high performance and low power consumption...
MOST Launches “AI Voice Data Set” to Assist Chinese AI Language Technology
TAIPEI, Taiwan - The Ministry of Science and Technology (MOST) on June 25 at The National Taiwan University of Science and Technology (Taiwan Tech) held the a press conference regarding the online launch of the “AI Voice Data Set...
MagnaChip Introduces New Component to Enhance 5G/LTE Smartphone Battery Life and Protection
MagnaChip Semiconductor announced today a new low-Rss(on) LV (Low Voltage) MOSFET with reduced chip size for smartphone battery PCMs (Protection Circuit Modules). Extended life and increased protection for batteries in high-end LTE and 5G smartphones are becoming increasingly important...
TTA Pavilion leads Tech Innovation for Tomorrow at Innovfest
The Ministry of Science and Technology (MOST) of Taiwan presents 28 tech startups from the tech startup supporting programs of MoST in 2019 Innovfest Unbound, showcasing their innovative tech solutions under name of Taiwan Tech Arena Pavilion (TTA Pavilion)...
Gartner Says Worldwide CRM Software Market Grew 15.6% in 2018
Worldwide spending on customer experience and relationship management (CRM) software grew 15.6% to reach $48.2 billion in 2018, according to research from Gartner, Inc. CRM remains both the largest and the fastest growing enterprise application software category...
eMemory’s NeoFuse Qualified on Winbond 25nm DRAM Process
HSINCHU, Taiwan – eMemory today announced that NeoFuse, its one-time programmable (OTP) non-volatile memory IP, has been qualified on Winbond 25nm DRAM process technology and ready for production. eMemory’s NeoFuse is compatible with existing DRAM process and can be used for DRAM repair in both chip probing (CP) tests and final tests to achieve multi-time repairs...
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