ASE and Cadence Deliver First System-in-Package EDA Solution
KAOHSIUNG, Taiwan - Advanced Semiconductor Engineering, Inc. and Cadence Design Systems today announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages...
NDRC and Samsung Are Said to Be Signing MOU, which Could Moderate DRAM Price Rises, Says TrendForce
The climbing prices of DRAM over the past six quarters have added the cost pressures of Chinese smartphone brands. As the result, China’s National Development and Reform Commission (NDRC) has expressed concerns to Samsung at the end of 2017...
NI and Shanghai University Collaborate on a 5G Ultra-Reliable Low-Latency Testbed for V2X
NI today announced plans to collaborate with Shanghai University on a testbed focused on 5G ultra-reliable low-latency communications (URLLC) for V2X applications. Vehicular networks, especially for autonomous driving applications, must offer ultra-reliability while requiring very low latency...
SolarEdge and OMRON Launch a New DC Inverter Solution for Japan’s High-voltage PV Market
SolarEdge Technologies and OMRON Corporation are launching a new DC optimized inverter solution for Japan’s high-voltage PV market. OMRON will offer SolarEdge's three-phase DC optimized inverter solution, consisting of inverters, power optimizers, and module-level monitoring, for the high-voltage Japanese PV market...
Shipments of Gaming Monitors to Grow by 40% in 2018, Says TrendForce
According to the latest report by WitsView, a division of TrendForce, the shipments of gaming monitor (with a frame rate above 100Hz) recorded about 2.5 million units in 2017, an annual growth of 80%. TrendForce forecasts that the shipments will increase by another 1 million units this year, totaling around 3...
Nanowire LED Innovator Aledia Announces $36 Million Series-C Financing; Intel Capital Joins
Aledia, a developer and manufacturer of next-generation 3D LEDs for display applications based on its gallium-nitride-nanowires-on-silicon platform, today announced the closing of its Series C financing round with Intel Capital as a new investor...
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