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New LED Components for Automotive Lighting, Featuring Chip-Scale Packaging
Published: Jun 21,2016Samsung Electronics announced that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging* and flexible circuit board technology, for use in automotive lighting applications.
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“Our new Fx-CSP line-up will bring greater design flexibility and cost competitiveness to the automotive lighting industry,” said Jacob Tarn, executive vice president, LED Business Team, Samsung Electronics. He added that, “We will continue to introduce innovative LED products and technologies, such as multi-chip array technology, that can play a key role in the growth of the automotive LED lighting industry.”
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