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SK Hynix Introduces Industry
Published: Apr 10,2017SK Hynix Inc. today introduced the industry's first 72-Layer 256Gb (Gigabit) 3D (Three-Dimensional) NAND Flash based on its TLC (Triple-Level Cell) arrays and own technologies.
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The company stacks 1.5 times more cells for the 72-Layer 3D NAND than it does for the 48-Layer 3D which is already in mass production. A single 256Gb NAND Flash chip can represent 32GB (Gigabytes) storage.
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Phone:+886 2 2585-5526
E-Mail:en@ctimes.com.tw