Article
TSMC and NCTU Work on Wafer-scale One-atom-thick Insulating Layer Technology
Published: Mar 17,2020TAIPEI, Taiwan - Under long-term support from the “Taiwan Consortium of Emergent Crystalline Materials” (TCECM) program of the Ministry of Science and Technology (MOST), Taiwan, a research team at National Chiao Tung University (NCTU) collaborated with Taiwan Semiconductor Manufacturing Company (TSMC) to form an industry-university joint research team, reporting a breakthrough in the synthesis of one-atom-thick boron nitride (BN). The joint research team successfully developed a method to synthesize wafer-scale and single-crystal BN, which may be applied toward the fabrication of advanced logic integrated circuits. This outstanding fundamental research result was published in the top journal ?Nature? in March 2020.
Sorry, your permission level is not enough, can’t read this article, please Log in or register as CTIMES member for free, CTIMES membership privileges as following table:
| Membership Level | Permissions of news | Permissions of articles | permissions of Publications |
| Visitors | 10 news in 30 days | None | Pay to download |
| Register Member | No Limit | 10 articles in 30 days | Pay to download |
| VIP member | No Limit | 20 articles in 30 days | Pay to download |
| Subscribed Member | No Limit | No Limit | Have special discount |
4240 Read
Top Stories
comments powered by Disqus





