Taipei, Saturday, Jun 13, 2026, 11:10

Article

TSMC and NCTU Work on Wafer-scale One-atom-thick Insulating Layer Technology

Published: Mar 17,2020

TAIPEI, Taiwan - Under long-term support from the “Taiwan Consortium of Emergent Crystalline Materials” (TCECM) program of the Ministry of Science and Technology (MOST), Taiwan, a research team at National Chiao Tung University (NCTU) collaborated with Taiwan Semiconductor Manufacturing Company (TSMC) to form an industry-university joint research team, reporting a breakthrough in the synthesis of one-atom-thick boron nitride (BN). The joint research team successfully developed a method to synthesize wafer-scale and single-crystal BN, which may be applied toward the fabrication of advanced logic integrated circuits. This outstanding fundamental research result was published in the top journal ?Nature? in March 2020.

Sorry, your permission level is not enough, can’t read this article, please Log in or register as CTIMES member for free, CTIMES membership privileges as following table:
Membership Level Permissions of news Permissions of articles permissions of Publications
Visitors 10 news in 30 days None Pay to download
Register Member No Limit 10 articles in 30 days Pay to download
VIP member No Limit 20 articles in 30 days Pay to download
Subscribed Member No Limit No Limit Have special discount

4240 Read

comments powered by Disqus