Lu Qian-hao, officer of ZTE says that ZTE a.ims at shipping out 6 billion smartphones in 2014, and hopes to side with Taiwan components firms, including Unitech and COMPEQ.

Due to China smartphones like ZTE seeks for chances in Taiwan, it is believed that the High Density Interconnection (HDI) firms of Taiwan will better their performance at quarter two.

“ZTE ships out 4.2 billion smartphones last year, and our goal is to increase 1.8 billion more this year,” says Lu Qian-hao, “One of our previous smartphone models, 80 percent of the components are from Taiwanese firms.” Referring to that technology and budget control are two advantages of Taiwanese firms.

Lu furthur states that China smartphones are not only seeking cooperation in HDI or Flexible Print Circuit (FPC), FPC design, wiring, OEM/ODM, and even to develop new products together.

Morever, Lu points out that there shall be plenty of collaborating opportunities between China smartphone brands and Taiwan components firms, with the view that the smartphone market in China is huge, which can be viewed as a good news for Taiwan components firms.