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Mentor Graphics Analog FastSPICE Platform Certified by TSMC 16nm FinFET Manufacturing Processes

By Vincent Wang
Published: May 16,2014

TAIPEI, Taiwan — Mentor Graphics Corp. announced earlier this week that the Analog FastSPICE (AFS) Platform and AFS Mega have

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been certified for version 1.0 SPICE of the TSMC 16nm FinFET process technology through its SPICE Simulation Tool Certification Program.

Analog, mixed-signal, and RF design teams at leading semiconductor companies worldwide now can use Analog FastSPICE to efficiently verify their chips designed in 16nm FinFET technology.

“The Mentor Analog FastSPICE Platform and AFS Mega have successfully met the accuracy and compatibility requirements for 16nm FinFET technology,” said Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division.

The Analog FastSPICE Platform provides fast circuit verification for nanometer analog, RF, mixed-signal, memory, and custom digital circuits. For large circuits the AFS Platform delivers greater than10M-element capacity and fast mixed-signal simulation.

For memory and other array-based circuits, AFS Mega delivers silicon-accurate simulation with greater than 100M-element capacity. For silicon-accurate characterization it includes the industry's only comprehensive full-spectrum device noise analysis and a high-productivity Analog Characterization Environment (ACE).

Available licenses for the AFS Platform include AFS Circuit Simulator, AFS Mega, AFS Nano, AFS Transient Noise Analysis, AFS RF Analyses, AFS Co-Simulation, AFS AMS, and ACE product.

“Being certified by TSMC's 16nm FinFET Certification Program is an important milestone to support our mutual customers' success as they move to this advanced node,” said Ravi Subramanian, General Manager of AMS verification in the DSM division, Mentor. “By working closely with TSMC, we can provide assurance that these customers have the nanometer verification platform that has the accuracy required for the most complex and highly integrated nanometer analog, mixed-signal, and RF designs.”

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