As the next big thing is coming. TSMC is ready for the application of smart home, smart city, wearables, and smart cars. Sensors including CIS, MEMS bio, motion, temperature. Ultra low-power that consisted of processors, MCU, Memory. Advanced SiP along with InFO, CoWos. Connectivity and RF, mm, Optical are all the TSMC core technology for the next big thing.

Take the TSMC comprehensive technology portfolio into account. RF, embedded flash, BCD-power IC, MEMS, analog, image sensor, high voltage belong to specialty technology. Logic is the advanced technology, and these are the so-called advanced packaging.

“TSMC has expanded R&D division to 4,500 employees in 2014.” Said C.C. Wei. Referring to how TSMC keeps it's technology lead status. When talking about the advanced package, TSMC's 20nm is on the go, 16nm is at the experimental stage, and 10nm is at the R&D stage

20nm is in aggressive volume ramp with record pace in TSMC history, according to TSMC, it is believed that 300K wafers will be manufactured by the Q4 in 2014.

TSMC also introduced its “Super Manufacture Platform” (SMP) that ensures cross-fab performance matching. TSMC's advanced fab embedded with highly integrated manufacturing systems which enable a people-less GigaFAB operation. The defect-free rate can reach to 99.8 percent.

TSMC now has 8,600 products and 440 customers in the world.