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Facing More Challenges, TSMC Better Gear Up for Future

By Linx Wang
Published: Aug 13,2014

TAIPEI, Taiwan-TSMC should feel a little relieved now, because intel yesterday announced their 14nm process technology, and launch schedule will be later than TSMC. But this doesn’t mean challenges disappear, on the contrary, TSMC should be taken seriously.

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TSMC claims that its 16nm FinFET+ is more competitive than Intel's 14nm and to pull out the distance between Samsung and Intel, TSMC will speed up the 16nm FinFET+ into mass production process in Q3. The first product will be Chinese IC designer Hisilicon's 64bit mobile Soc Kirin930. If the result turns out to be good, expecting the Apple A9 chips will be ordered.

Few weeks ago, Morris Chang, the CEO of TSMC talked about that next year the 16nm production pace between Samsung will be a little fall behind, but he has faith in TSM in long-run. Facing the competition of Samsung and Intel, TSMC also devote into 10nm research. The production of first lot of 16nm is also going well.

There are rumors about Samsung cut out the order of TSMC for Apple’s next generation A9 chips, but according the equipment provider of TSMC, the 16nm production in Q4 includes Apple’s A9 chips. FitFET+ will be in mass production next year Q1.

TSMC’s 12 inch Fab14 sixth stage is in good processing, seventh and eighth stage for 16nm will be fully working in the end of the year, there for the advantage in technology and production will be stabled.

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