Taipei, Friday, May 03, 2024, 02:15

News

Spansion and Winbond Sign Licensing Agreement

Published: Sep 24,2014

Spansion Inc. announced the signing of a cross-license agreement with Winbond Electronics Corporation, a Taiwanese supplier of specialty memory. This gives both companies access to each other's Flash memory patent portfolio.

More on This

Winbond Releases 2Gb NAND+2Gb LPDDR4x Multi-Chip Package for 5G CPE Modems

TAICHUNG CITY, Taiwan-- Winbond Electronics today announced the launch of a new 1.8V 2Gb+2Gb NAND Flash and LPDDR4x memory product in a compact 8...

Winbond Announces New 1.8V Confidential and Replay-Protected Flasay-protected Flash Storage Products

TAICHUNG CITY, Taiwan –Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, t...

"This agreement reflects the strong IP position of both companies and our ongoing commitment to provide and have access to valuable memory patents in the industry," said Ali Pourkeramati, senior vice president of strategic alliances at Spansion.

"We believe the cooperation between Spansion and Winbond will be positive for our customers, enabling them to benefit from innovation and new technologies."

Flash memory is a critical part of billions of dollars worth of consumer electronics such as cartridges for gaming devices, digital cameras, networking equipment, set-top-boxes, and notebook and tablet computers.

"The agreement opens up opportunities for both companies to leverage each other's strengths to broaden the product portfolio and collaborate on new products," said John Park, Vice President of Flash Memory Business Group at Winbond.

CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to en@ctimes.com.tw

660 viewed

Most Popular

comments powered by Disqus